Panasonic DVD-S32EB Manuel utilisateur

ORDER NO.CHM0602004CE

DVD Player

DVD-S32EB / DVD-S32GN / DVD-S32PX

DL4.5 Mechanism Series

Color

(S).......................Silver Type

SPECIFICATIONS

Specifications

Power supply: AC230-240 V, 50 Hz

(DVD-S32EB/GN)

AC110-240 V, 50/60 Hz

(DVD-S32PX)

Power consumption: 10 W

Power consumption in standby mode:

approx. 1 W

Dimensions: 430 (W) × 251 (D) × 43 (H) mm

Mass: 2.2 kg (approx.)

Signal system: PAL 625/50, PAL 525/60, NTSC

(DVD-S32EB/GN)

NTSC

(DVD-S32PX)

Operating temperature range: + 5 to + 35 °C

Operating humidity range: 5 to 90 % RH (no

condensation)

Discs played [8 cm (3 ” ) or 12 cm (5 ” )]:

(1) DVD (DVD-Video)

(2) DVD-R (DVD-Video, MP3*2,4, JPEG*3,4)

(3) DVD-RW (DVD-Video, MP3*2,4, JPEG*3,4)

(4) +R/+RW (Video)

(5) CD, CD-R / CD-RW (CD-DA, Video CD, SVCD*1, MP3*2,4,

JPEG*3,4)

(6) DVD-R DL (DVD-Video)

(7) +R DL (Video)

*1 Conforming to IEC62107

*2 MPEG-1 Layer 3, MPEG-2 Layer 3

*3 Exif Ver2.1 JPEG Baseline files

Picture resolution: between 320 × 240 and 6144 × 4096

pixels (Sub sampling is 4:2:2 or 4:2:0)

*4 The total combined maximum number of recognizable

audio and picture contents and groups: 1000 audio and

picture contents and 256 groups.

Video output:

Output level: 1 Vp-p (75 )

Output terminal: Pin jack (1 system)

(DVD-S32GN/PX)

Pin jack (1 system)/AV

(DVD-S32EB)

S video output:

Y output level: 1 Vp-p (75 )

C output level: 0.286 Vp-p (75 )

(DVD-S32PX)

NTSC: 0.286 Vp-p (75 )

PAL: 0.300 Vp-p (75 )

(DVD-S32EB/GN)

Output terminal: S terminal (1 system)

(DVD-S32GN/PX)

(DVD-S32EB)

Component video output: [NTSC: 525(480)p/525(480)i,

PAL: 625(576)p/625(576)i]

(DVD-S32EB/GN)

[NTSC: 525(480)p/525(480)i]

(DVD-S32PX)

Y output level: 1 Vp-p (75 )

P B output level: 0.7 Vp-p (75 )

P R output level: 0.7 Vp-p (75 )

Output terminal: Pin jack (Y: green, P B : blue,

P R : red)

Number of terminals: 1 system

RGB video output: (DVD-S32EB)

R output level: 0.7 Vp-p (75 )

G output level: 0.7 Vp-p (75 )

B output level: 0.7 Vp-p (75 )

Output terminal: AV

Video performance:

Horizontal resolution: More than 500 lines

Video S/N ratio: More than 65dB

Audio output:

Output level: 2 Vrms (1 kHz, 0 dB)

Output terminal: Pin jack

(DVD-S32GN/PX)

Pin jack/AV

(DVD-S32EB)

Number of terminals:

2 channel: 1 system

Audio performance:

(1) Frequency response:

DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)

4 Hz-44 kHz (96 kHz sampling)

CD audio: 4 Hz-20 kHz

(2) S / N ratio:

CD audio: 115 dB

(3) Dynamic range:

DVD (linear audio): 92 dB

CD audio: 90 dB

(4) Total harmonic

distortion:

CD audio: 0.003 %

Digital audio output:

Coaxial digital output: Pin jack

Pickup

Wave length: 653 nm / 790 nm

Laser power: CLASS 1 / CLASS 3A

Note:

Specifications are subject to change without notice.

Mass and dimensions are approximate.

Solder:

This model uses lead free solder (PbF).

Unauthorized copying and distribution is a violation of law.

1. SAFETY PRECAUTIONS

1.1. GENERAL GUIDELINES

1. When servicing, observe the original lead dress. If a short circuit is

found, replace all parts which have been overheated or damaged by the

short circuit.

2. After servicing, see to it that all the protective devices such as

insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent

the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug the AC cord and connect a jumper between the two prongs on

the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metallic cabinet part on the

equipment such as screwheads, connectors, control shafts, etc. When

the exposed metallic part has a return path to thechassis, the reading

should be between 1M and 5.2M . / When the exposed metal does

not have a return path to the chassis, the reading must be .

Figure 1

1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation

transformer for this check.

2. Connect a 1.5k , 10 watts resistor, in parallel with a 0.15 F

capacitors, between each exposed metallic part on the set and a good

earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each

point.

5. Reverse the AC plug in the AC outlet and repeat each of the above

measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage

current tester (Simpson Model 229 or equivalent) may be used to make

the hot checks, leakage current mu3st not exceed 1/2 milliamp. In case

a measurement is outsideof the limits specified, there is a possibility of

a shock hazard, and the equipment should be repaired and rechecked

before it is returned to the customer.

2. PREVENTION OF ELECTRO STATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such

components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components.

The following techniques should be used to help reduce the incidence of component damage caused

by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any ESD on your body by

touching a known earth ground. Alternatively, obtain and wear a

commercially available dischargingESD wrist strap, which should be

removed for potential shock reasons prior to applying power to the unit

under test.

2. After removing an electrical assembly equipped with ES devices, place

the assembly on a conductive surface such as alminum foil, to prevent

electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static solder removal device. Some solder removal

devices not classified as "anti-static (ESD protected)" can generate

electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical

charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package

until immediately before you are ready to install it. (Most replacement

ES devices are packaged with leads electrically shorted together by

conductive foam, alminum foil or comparableconductive material).

7. Immediately before removing the protective material from the leads of a

replacement ES device, touch the protective material to the chassis or

circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all

other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES

devices. (Otherwise hamless motion such as the brushing together of

your clothes fabric or the lifting of your foot from a carpeted floor can

generate static electricity (ESD) sufficient todamage an ES device).

3. PRECAUTION OF LASER DIODE

4. SERVICE CAUTION BASED ON LEGAL RESTRICTIONS

4.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed

circuit boards used for this equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the

alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free

solder is higher approx.30°C (86°F) more than that of the normal solder.

Definition of PCB Lead Free Solder being used

Service caution for repair work using Lead Free Solder (PbF)

- The lead free solder has to be used when repairing the equipment for

which the lead free solder is used. (Definition: The letter of “PbF” is

printed on the PCB using the lead free solder.)

- To put lead free solder, it should be well molten and mixed with the

original lead free solder.

- Remove the remaining lead free solder on the PCB cleanly for soldering

of the new IC.

- Since the melting point of the lead free solder is higher than that of the

normal lead solder, it takes the longer time to melt the lead free solder.

- Use the soldering iron (more than 70W) equipped with the temperature

control after setting the temperature at 350±30°C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

The following 3 types of lead free solder are available through the service parts route.

- RFKZ03D01K-----------(0.3mm 100g Reel)

- RFKZ06D01K-----------(0.6mm 100g Reel)

- RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt

(Co) / Germanium (Ge) 0.1 to 0.3%

5. PREVENTION OF STATIC ELECTRICITY DISCHARGE

The laser diode in the traverse unit (optical pickup) may brake down due to static electricity of clothes

or human body. Use due caution to electrostatic breakdown when servicing and handling the laser

diode.

5.1. Grounding for electrostatic breakdown prevention

Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be

damaged by static electricity in the working environment. Proceed servicing works under the working

environment where grounding works is completed.

5.1.1. Worktable grounding

1. Put a conductive material (sheet) or iron sheet on the area where the

optical pickup is placed, and ground the sheet.

5.1.2. Human body grounding

1. Use the anti-static wrist strap to discharge the static electricity form

your body.

5.1.3. Handling of optical pickup

1. To keep the good quality of the optical pickup maintenance parts

during transportation and before installation, the both ends of the laser

diode are short-circuited. After replacing the parts with new ones,

remove the short circuit accordingto the correct procedure. (See this

Technical Guide.)

2. Do not use a tester to check the laser diode for the optical pickup.

Failure to do so will damage the laser diode due to the power supply in

the tester.

5.2. Handling Precautions for Traverse Unit (Optical Pickup)

1. Do not give a considerable shock to the traverse unit (optical pickup)

as it has an extremely high-precise structure.

2. When replacing the optical pickup, install the flexible cable and cut its

short land with a nipper. See the optical pickup replacement procedure

in this Technical Guide. Before replacing the traverse unit, remove the

short pin for preventingstatic electricity and install a new unit. Connect

the connector as short times as possible.

3. The flexible cable may be cut off if an excessive force is applied to it.

Use caution when handling the cable.

4. The half-fixed resistor for laser power adjustment cannot be adjusted.

Do not turn the resistor.

6. DISASSEMBLING THE CASING AND CHECKING

P.C.B.S

6.1. Disassembly Procedure

6.2. Casing Parts and P.C.B. Positions

6.3. Top Panel

1. Unscrew the screws.

6.4. Front Panel

1. Release the tabs and connector.

2. Release the tabs.

6.5. Operation P.C.B. and Power SW P.C.B.

1. Unscrew the screws.

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