NI sbRIO-9637 Manuel utilisateur

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USER MANUAL
NI sbRIO-9637
Single-Board RIO OEM Devices
This document describes the features of the NI sbRIO-9637 and contains information about
operating the device.
Figure 1. NI sbRIO-9637 Block Diagram
Battery
FPGA
x4 Digital I/O (3.3 V, 5 V Tolerant)
Processor
Zynq-7020
sbRIO-9637
FPGA
LED
GIGE 0
PHY
ENET 0
Connector
User
LED
Status
LED
USB
PHY
USB
Connector
x24 Digital I/O (3.3 V, 5 V Tolerant)
On-board
Power
Supply
Power
Connector
SDIO
Connector
Real-time
Clock
512 MB
NAND Flash
CAN
XCVR
CAN Port 0
Connector
Serial Port 1
Connector
RS-232
XCVR
Serial Port 2
Connector
RS-485
XCVR
Serial Port 3
Connector
RS-232
XCVR
Temp
Sensors
40 MHz
Oscillator
MIO
Connector
DIO
Connector
x16 MUX
Analog Input
x4
Analog Output
512 MB
DDR3
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Contents
Mechanical Considerations....................................................................................................... 3
Dimensions........................................................................................................................3
Maximum Component Heights.........................................................................................5
Mounting...........................................................................................................................6
Managing Thermal Conditions......................................................................................... 9
Validating the System......................................................................................................11
Shock and Vibration........................................................................................................16
Ports and Connectors.............................................................................................................. 16
Connector Descriptions...................................................................................................17
Power Connector.............................................................................................................18
RJ-45 Gigabit Ethernet Port............................................................................................18
RS-232 Serial Ports.........................................................................................................19
RS-485 Serial Port.......................................................................................................... 20
CAN Port.........................................................................................................................21
DIO Port..........................................................................................................................22
MIO Port......................................................................................................................... 22
USB Host Ports............................................................................................................... 23
SD Connector..................................................................................................................24
RESET Button.........................................................................................................................24
System Reset................................................................................................................... 25
LEDs....................................................................................................................................... 25
POWER LED Indicators.................................................................................................26
STATUS LED Indicators.................................................................................................26
User LEDs.......................................................................................................................27
Ethernet LED Indicators................................................................................................. 28
Real-Time Clock (RTC) Battery............................................................................................. 28
Internal Real-Time Clock (RTC).............................................................................................29
Integrated 3.3 V Digital I/O.................................................................................................... 29
Integrated Analog Input.......................................................................................................... 29
Analog Input Range........................................................................................................ 29
Integrated Analog Output........................................................................................................37
Analog Output Startup and Initialization........................................................................ 37
Power Requirements............................................................................................................... 37
Wiring the Power Supply Connector.............................................................................. 37
Powering On the NI sbRIO Device.................................................................................38
Calculating the Power Requirement............................................................................... 38
Configuring the sbRIO-9637.................................................................................................. 39
Connecting the sbRIO-9637 to the Host Computer........................................................ 40
Configuring Startup Options...........................................................................................41
Configuring FPGA Startup App..................................................................................... 42
Connecting CAN Networks.................................................................................................... 43
CAN Bus Topology and Termination............................................................................. 43
Cable Specifications........................................................................................................43
Termination Resistors......................................................................................................44
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Cable Lengths................................................................................................................. 44
Number of CAN Nodes...................................................................................................44
File System..............................................................................................................................44
Worldwide Support and Services............................................................................................ 45
Mechanical Considerations
Proper mechanical design is critical for rugged environments in which the NI sbRIO device
may be subjected to extreme temperatures, shock, vibration, and other factors. In particular,
pay special attention to thermal performance to ensure that your application meets the
NI sbRIO device operating requirements.
Dimensions
The following figures specify dimensions for the sbRIO-9637.
Figure 2. Primary-Side Dimensions in mm (in.)
0.00 (0.000)
0.0 (0.000)
20.63 (0.812)
69.47 (2.735)
139.07 (5.475)
149.89 (5.900)
1
0.64
(0.025)
84.51 (3.327)
142.43 (5.607)
150.73 (5.934)
17.12 (0.674)
Pin 1
Pin 2
Pin 1
Pin 2
Pin 2
Pin 1
Pin 2
Pin 1
Pin 2
Pin 1
USB PHY
CPLD
NAND Flash
DDR Memory
CPU/FPGA
ENET PHY
64.38 (2.534)
38.24 (1.505)
31.84 (1.253)
11.19 (0.440)
10.76 (0.423)
10.30 (0.405)
77.33 (3.044)
51.82 (2.040)
66.73 (2.627)
50.17 (1.975)
62.85 (2.474)
44.36 (1.746)
Pin 2
Pin 1
18.13 (0.714)
17.17 (0.676)
1. Back of Front Panel
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Figure 3. Secondary-Side Dimensions in mm (in.)
150.47 (5.924)
76.84 (3.025)
3.20 (0.126)
102.87 (4.050)
98.40 (3.874)
6x
Ø
3.18 (0.125)
26.67 (1.050)
0.0 (0.00)
0.0 (0.00)
153.67 (6.050)
1
1. Holes and Keepouts Sized for M3 Standoff (4.5 mm Hex) or 4-40 Standoff (3/16-in. Hex)
Figure 4. Front Dimensions in mm (in.)
15.64 (0.616)
6.16 (0.242)
127.47 (5.018)
103.02 (4.056)
95.21 (3.748)
89.81 (3.536)
76.82 (3.025)
70.02 (2.757)
57.52 (2.265)
49.73 (1.958)
33.99 (1.338)
19.50 (0.768)
10.16 (0.400)
7.620 (0.300)
5.080 (0.200)
2.540 (0.100)
5.34 (0.210)
2.16 (0.085)
0.00 (0.000)
8.76 (0.345)
6.32 (0.249)
4.66 (0.183)
3.66 (0.144)
2.56 (0.101)
0.0 (0.00)
18.16
(0.715)
1
1. Minimum Clearance for Latch on Mating Power Connector
Tip For two-dimensional drawings and three-dimensional models of the
sbRIO-9637, visit ni.com/dimensions and search by model number.
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Maximum Component Heights
The primary side of the sbRIO-9637 is the top side of the PCB populated with the power and
Ethernet connectors. The secondary side is the bottom. The following figures show the
maximum component heights for the different regions of the primary and secondary sides.
Note In addition to the maximum component heights, you must also observe
minimum keepaway distances for adjacent PCBs and surfaces.
Figure 5. Maximum Component Height of Primary Side
31.75 mm
(1.250 in.)
96.52 mm (3.800 in.)
Max Component Height =
9.53 mm (0.375 in.)
Min Adjacent Surface Height =
9.53 mm (0.375 in.)
Min Adjacent Surface Height =
8.89 mm (0.350 in.)
Max Component Height =
7.11 mm (0.280 in.)
Max Component Height =
17.27 mm (0.680 in.)
Min Adjacent Surface Height =
19.05 mm (0.750 in.)
Figure 6. Maximum Component Height of Secondary Side
Max Component Height =
6.15 mm (0.242 in.)
Min Adjacent Surface Height =
7.62 mm (0.300 in.)
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Mounting
You can mount the NI sbRIO device in a variety of ways in order to maximize system
performance. Some mounting methods might require custom fasteners or unique assembly
techniques to maintain required connector stack heights and enable improved thermal and
structural design for rugged environments.
Mounting Direction Options
The sbRIO-9637, Thermal Kit for NI sbRIO-9607/9627/9637 (153901-02), and certain RMC
accessories are designed to allow traditional M-F standoff threads to pass through and stack in
either direction. The following figures show possible mounting configurations and associated
fastener types.
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Mounting on a Panel or Plate with Conduction Path
If possible, NI recommends that you mount the sbRIO-9637 on a panel or plate, such that a
thermal solution provides a conduction path from the primary side components and is secured
to or made from the panel or plate, as shown in the following figure.
Figure 7. Mounting on a Panel or Plate
1
2
3
4
6
7
8
5
1. Exploded view of all mounting components
2. Complete assembled and mounted view
3. Mounting screws
4. Standoff, 16.00 mm (0.63 in.)
5. Thermal Kit for NI sbRIO-9607/9627/9637
(153901-02)
6. NI sbRIO-9637
7. Standoff, 18.00 mm (0.71 in.)
8. Mounting surface
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Mounting on a Panel or Plate with Convection Path
Alternatively, the thermal solution can be used for convection to natural or forced air flow or
used in conjunction with a heat sink optimized for the environment.
Figure 8. Mounting on a Panel or Plate
1
2
3
4
5
6
7
8
9
1. Exploded view of all mounting components
2. Complete assembled and mounted view
3. Heatsink
4. Thermal Kit for NI sbRIO-9607/9627/9637
(153901-02)
5. NI sbRIO-9637
6. Mounting screws
7. Standoff, 16.00 mm (0.63 in.)
8. Standoff
9. Mounting surface
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Chassis Grounding Connections
The sbRIO-9637 provides a multi-function bracket that can be used with the supplied 4-40
grounding screw for directly attaching ground connections or for attaching to and grounding a
front panel as shown in the following figure.
Figure 9. sbRIO-9637 Chassis Grounding Screw
1
1. Chassis Grounding Screw
The front I/O connector shields, chassis ground bracket, and mounting holes near the front I/O
are connected together internally to form chassis ground. Chassis ground is capacitively
coupled to digital ground near each of the IO connectors. For the best possible ESD protection,
connect chassis ground at the mounting holes or the chassis ground bracket to a low-
inductance earth ground.
When connecting the NI sbRIO device to external devices, ensure that stray ground currents
are not using the device as a return path. Significant stray currents traversing through the
NI sbRIO device can result in device failure.
To verify correct grounding of the NI sbRIO device, make sure the current flowing into the
power connector equals the current flowing out of the power connector. These currents should
be measured with a current probe after final assembly of the end system. Investigate and
remove any current differences.
Managing Thermal Conditions
Due to the small size of the sbRIO-9637, it is very important to appropriately dissipate the heat
generated during operation. You must plan for the thermal conditions of your application
throughout development and validation. This section provides design recommendations and
validation tools and methods for maximizing the thermal performance of the system.
Designing a Suitable Enclosure
NI sbRIO devices operate as components in a higher-level system and may require an
enclosure to protect the internal circuit card assembles and dissipate heat. For the sbRIO-9637,
the system integrator is responsible for designing an enclosure that meets the thermal
requirements of your specific application.
NI sbRIO devices integrated into an enclosure or system with proper thermal dissipation can
be deployed in high- and low-temperature environments. However, the 85 °C local ambient
operating temperature rating of the sbRIO-9637 does not mean that the external temperature of
the natural convection environment such as a room or larger enclosure can be 85 °C. In this
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