HPE Edgeline EL1000 Instructions de montage
MF877-00
Template Revision A
Page
1
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Edgeline EL1000
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
ItemDescription
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containingcomponents
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries No
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps No
0
Cathode RayTubes (CRT)
No
0
Capacitors / condensers (Containing PCB/PCT)
No
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Depends on PSU Module
6
External electrical cables and cords
0
Gas Discharge Lamps
No
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
No
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. No
0
Components and waste containing asbestos
No
0
1.0 Items Requiring Selective Treatment
MF877-00
Template Revision A
Page
2
HPE instructions for this template are available at MF877-01
ItemDescription
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractoryceramic fibers
No
0
Components, parts and materials containing
radioactivesubstances
No
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T-10/15
PhilpsScrewdriver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
System Board Battery (1G/10G I/O Board)
a.
Remove 2 screws on rear side of Juno Chassis with T-10 Driver.
b.
Slide Hood and remove 2 Black Screw with T15 Driver to detach PCIe/PXIe Baseboard Kit.
c.
Remove 2 HDD Cage Screw with T10 Driver than you could
2.
Capacitance
Capacitance which is inserted byoperator
a.
let tin touch the two pin of the capacitance
b.
second, soldering tin the points with Soldering Station which set the temperature to 330
c.
10oC for L/F model , if non-L/F model, set the temperature to 300
d.
10oC, remove capacitance from PCB after tin completely melting, and then put it into Recycled Box(Remark:if
capacitance which is disassembled is GND ,Set the Soldering Station(Gao Zhou)temperature to 300 �10oC,
remove capacitance from PCB after tin completely melting,
e.
Put it into Recycled Box
(Remark: if capacitance which is disassembled is GND, Set the Soldering Station (Gao Zhou)
3.
Capacitors in 800W/500W PSU
a.
2.5 cm Pull down the lid to release the power supply from Chassis
b.
Removing 2 screw on the Bottom Side with T15 Driver
c.
Removing 1 screw on the Right Side with Philips Driver
d.
Removing 4 screw on the Fan Module
e.
Open its cover and locate the capacitors and pry from the PCB with a flat head screw driver or long nose plier and
dispose of properly.
MF877-00
Template Revision A
Page
3
HPE instructions for this template are available at MF877-01
3.2
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
Attachment 1 - System Exploding Drawing
Attachment 2- System BatteryLocation
Attachment 3 –Remove Fan Kit
Attachment 4 - Remove 500W/800W PSU
Attachment 5 –PSU Capacitor Location
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