HP ProLiant ML110 G7 Instructions de montage

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Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HP ProLiant ML110 G7

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 2

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 1

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

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Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Trox Driver T10/T15

Philips Screw Driver #2

Flat Head Screw Driver Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. System Board Battery - Locate the battery on the system board. Use a medium flat head screwdriver or fingers to

remove the battery and dispose of properly

2. Capacitors=>2.5CM - Remove the power supply from the system using a T-15 driver. With #2 Philips screw driver,

remove the screws securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head

screw driver and dipose of properly

3. BBWC Battery – With a medium flat head screw driver remove the BBWC battery and dispose of properly

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1- Expanded view

Attachment 2 – System Battery Location

Attachment 3- Location of BBWC Battery

Attachment 4,5,6,7- Capacitor location by model number of supply

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Attachment 1

Attachment 2

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Attachment 3

350W ATX Power supply

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Attachment 4

Attachment 5

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Attachment 6

Attachment 7

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