HP Integrity BL860c i4 Manuel utilisateur

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Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HP Integrity BL860c i4 Server Blades

HP Integrity BL870c i4 Server Blades

HP Integrity BL890c i4 Server Blades

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Server unit is configurable and may contain some of

the following assemblies:

AM377-60001 PCA, BL8x0c i4 System Board

AD399-2134A CPU Socket Airflow baffle

AM377-60002 PCA, BL1

AM377-60003 PCA, BL2

AM377-60010 PCA, BL2EM

AM377-60011 PCA, BL2ES

AM377-60006 PCA, BL4M

AM377-60007 PCA, BL4S

AM377-60033 PCA, Upgrade BL2

AM377-60036 PCA, Upgrade BL4M

AD399-60009 PCA, SAS BackPlane

AM377-60013 PCA, ICH w/TPM

AD399-60013 PCA, ICH-WITHOUT TPM

AT085-2022A HP BL8x0c i4 Itanium 9560 8c Proc

AT085-2021A HP BL8x0c i4 Itanium 9540 8c Proc

AT085-2020A HP BL8x0c i4 Itanium 9550 4c Proc

AT085-2019A HP BL8x0c i4 Itanium 9520 4c Proc

AT085-2026A HP BL8x0c i4 Itanium 9560 8c Proc

AT085-2025A HP BL8x0c i4 Itanium 9540 8c Proc

Up to 137

(when fully

loaded)

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AT085-2024A HP BL8x0c i4 Itanium 9550 4c Proc

AT085-2023A HP BL8x0c i4 Itanium 9520 4c Proc

605312-371 DIMM,4GB PC3L-10600R,512Mx4

605313-371 DIMM,8GB PC3L-10600R,512Mx4

628974-381 DIMM,16GB PC3L-10600R,1Gx4

507129-

009 HP 146GB 6G SAS 15K 2.5in DP HDD

507129-003 HP 300GB 6G SAS 10K 2.5in DP HDD

507129-

019 HP 300GB 6G SAS 15K 2.5in DP HDD

507129-

011 HP 450GB 6G SAS 10K 2.5in DP HDD

507129-

013 HP 600GB 6G SAS 10K 2.5in DP HDD

507129-

017 HP 900GB 6G SAS 10K 2.5in DP HDD

632520-003 HP 200GB SAS 2.5in SSD SLC Drive

632520-005 HP 400GB SAS 2.5in SSD SLC Drive

613433-001 HP NC553m DP FlexFabric Adptr

580153-001 HP NC551m DP FlexFabric Adptr

454521-002 HP NC532m NIC Adapter

445976-001 HP NC360m NIC Adapter

610607-001 HP NC552m Flex-10GbE Dual Port

447881-001 HP NC364m NIC Adapter

451872-001 HP QLogic QMH2562 8Gb FC HBA

456973-001 HP Emulex LPe1205 8Gb FC HBA

592519-B21 HP 4X QDR IB CX2 Dual Port HCA

613811-001 HP Smart Array P711M/1G FBWC

Batteries

All types including standard alkaline and lithium coin

or button style batteries

452348-B21 - HP SA P-Series Low Profile Battery

CR2032 on System Board

Up to 8

(when fully

loaded)

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

None

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

None

Cathode Ray Tubes (CRT)

None

Capacitors / condensers (Containing PCB/PCT)

None

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

None

External electrical cables and cords

None

Gas Discharge Lamps

None

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

None

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

None

Components and waste containing asbestos

None

Components, parts and materials containing

refractory ceramic fibers

None

Components, parts and materials containing

radioactive substances

None

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T10

T15

T20

T25

T27

T30

Phillips screw driver

Flat-head screw driver

1/8"

5/32"

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Power off the server, and remove it from the enclosure before continuing

2. Remove BladeLink assembly from the front of the Blade, if attached.

3. Remove panels from the Blade by either Torx or screwdriver.

4. Server Battery – locate battery and remove by hand or small flat blade screw driver. See visual below.

5. Supercap Pack (if applicable) – locate capacitor and pry from the printed circuit board with a large flat head screw

driver. See visual below.

6. Printed Circuit Boards – follow removal instructions found in the system specific documentation if needed. Some details

below.

10.

11.

12.

13.

14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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WARNING! Before proceeding with Disassembling a Blade that requires

Physical contact with electrical or electronic components, ensure that power is removed or safety

precautions are followed to prevent electric shock and equipment damage. Observe all warning and caution

labels on equipment.

CAUTION: Electrostatic discharge can damage electronic components. Ensure you are properly grounded

before beginning an installation procedure.

WARNING! The computer contains an internal lithium manganese dioxide, a vanadium pent oxide, or an

alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce

the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

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• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

• Replace only with the spare designated for this product.

Server battery

Supercap Pack (if applicable)

DIMM baffle

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DIMMs

1. Open the DIMM slot latches.

2. Remove the DIMM from the slot.

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Processor Baffle

Processor and heatsink module

1. Rotate the processor locking handle up and back until it reaches a hard stop (see 2 below).

WRNING! The heatsink locking lever can constitute a pinch hazard; keep your hands on top of the lever

during installation to avoid personal injury.

2. Pull both plastic tabs out

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3. Lift the processor and heatsink off of the socket, pulling straight up.

Removing a disk drive blank

Remove the component as indicated:

Removing a disk drive

1. Press the release button.

2. Open the ejector lever.

3. Slide the disk drive out of the drive cage.

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SAS backplane

1. Remove the disk drives or disk drive blanks (“Removing a disk drive” or “Removing a disk drive

blank”).

2. Lift the SAS back plane straight out of the server by the backplane handle.

Mezzanine card

EL-MF877-00 Page 10

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For more details on removing components, see HP Integrity BL860c i4, BL870c i4 & BL890c

i4 Server Blade User Service Guide.

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