HP S2032a Instructions d'installation

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Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP S2032a LCD Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 SCREW DRIVER(PHILLIPS HEAD)

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. External Electric Cables Dissecting Process

2. Remove Stand Base From Display Head

3. Remove Rear Cover From Display Head

4. Remove Front Cover From Display Head

5. Remove Key Board Off From Front Cover

6. Take Screw(x9)Off From Chassis Cover

7. Remove Interface BD and Power BD From Chassis

8. Explode Stand Base

9. Take Screw(x3) Off From P.C.B

10. LCD PANEL EXPLODE

11. Electrolytic Capacitors Over 25mm High& Diameter Dissecting Process

12. Electrolytic Capacitors Process Drawing

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP S2032a Disassembly Process

Jan-19-2010

External Electric Cables Dissecting Process

1.Remove Cable From Display Head.2.Dissecting To Complete.

Power Cord

VGA Cable

Remove Stand Base From Display Head

2. Remove Stand Base From Display Head.

1. Take screw(x3) off from display head

Remove Rear Cover From Display Head

1. Take screw(x1) off from display head

Remove Front Cover From Display Head

5. Remove Front Cover.

1.Remove light pipe Connector 2.Remove two pieces of AI foil

3.Remove FFC Connector

4.Remove key BD Connector from Interface BD

Remove Key Board Off From Front Cover

1. Take Screw(x2) Off From Front Cover

2. Remove key board from FC

Take Screw(x9) Off From Chassis Cover

1. Take screw (X5) off from Interface BD and Power BD

2. Take screw (X4) off from Interface BD and Power BD

Remove Interface BD and Power BD From Chassis Cover

1.Remove interface BD and power BD from chassis

cover

2.Remove rubber and sponge from chassis cover

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