HP Pavilion 23xi Instructions d'installation

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Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion 23xi 23-Inch IPS LED Backlit Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

PH2

Hex nut screwdriver

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Quick release Base stand

2. Strip the screws from rear cover so that the rear metal cover can be removed , after be turn back;

3. Strip the five screws from panel holder

4. Push up and disassemble the cover from the panel

5. To remove the shielding(contain the other material )

6. Strip the screws

7. Release all materials and put some by ESD

3.2 Optional : Depending upon the complexity of the disassembly process, a graphic depicting the locations of items contained within

the product which require selective treatment (with descriptions and arrows identifying locations) can be inserted below:

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Step 1 Quick release Base stand

(1).Pull out base and stand

(2).Disassy base and stand

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Step 2: Strip the screws from rear cover so that the rear metal cover can be removed , after be

turn back;

Step 3: Strip the four screws from panel holder ; such as bellow;

Step 4:Push up and disassemble the cover from the panel;

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Step 5: To remove the shielding(contain the other material );

(4.1) Remove the acetate tapes covering the LVDS/ LED FFCs;

(4.2) Pull out the LVDS/ LED FFCs to separate the base assembly from the unit;

l l

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Step 6: Strip the screws *8pcs

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Step 7: Release all materials and put some by ESD;

Can follow the picture as bellow;

The overall look when finished

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