HP P174 Instructions d'installation

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP P174 17-inch Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sqcm

IF board*1,KP board*1,Power board*1,

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lampspanel*1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

power board

External electrical cables and cords

VGA cable*1, Power cord*1, All are inside monitor

carton box

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Disassembly Tool (Better)

Bolt screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassemble Stand: Put the monitor on the desk horizontally with soft stuff to protect panel, then separate stand from

monitor as shown.

2. Disassemble Bucket: Remove the bucket screws.

3. Disassemble Bucket: Use disassembling tool to separate back cover from monitor (starting from the disassembiing

hole as shown)

4. Disassemble Panel Assembly: Taking off the LVDS cable and lightbar cable and keypad cable firstly,then separate

bezel and panel

5. Disassemble Bezel Assembly: Use screwdriver to disassemble keypad and take down the spk bar as shown.

6. Disassemble Chassis Assembly: Take down the power board mylar firstly.then use cross /bolt screwdriver

disassembling pi&if board

7. Disassemble Stand Assembly: Press stand arm quick release to disassemble arm and base

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Product Disassembly Process

Disassemble

Stand:

put the monitor on

the desk

horizontally with

soft stuff to

protect panel, then

separate stand

from monitor as

shown.

N/A

Disassemble

Bucket:

remove the bucket

screws

Cross

Screwdriver

Disassemble

Bucket:

use disassembling

tool to separate

back cover from

monitor (starting

from the

disassembiing

hole as shown)

Disassembling

Tool (Better)

Disassemble

Panel Assembly:

taking off the

LVDS cable and

lightbar cable and

keypad cable

firstly,then

N/A

separate bezel and

panel

Disassemble

Bezel Assembly:

use screwdriver

to disassemble

keypad and take

down the spk bar

as shown.

Cross

Screwdriver

Disassemble

Chassis

Assembly:

take down the

power board

mylar firstly.then

use cross /bolt

screwdriver

disassembling

pi&if board

Cross

Screwdriver

& Bolt

screwdriver

Disassemble

Stand Assembly:

Press stand arm

quick release to

disassemble arm

and base

N/A

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