HP Compaq LE2002xm Instructions d'installation

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

+3&RPSDT/([PLQFK/('%DFNOLW/&'0RQLWRU

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 SCREW DRIVER(PHILLIPS HEAD)

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Dismantle the screws of stand and rear cover，get down the stand

2. Dismantle the Rear cover of monitor

3. Pull out the pin of KEPC board

4. Dismantle the Bezel of monitor

5. Pull out the PIN of FFC cable，separate the mainframe and Panel

6. Dismantle the PCBA screws

7. Take off board

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP-LE2002Xm

disassembly SOP

From：NPI/IE/Jany

Date ：Sep.-29-11

Unscrewing the screws from stand and

cover, move away stand

Moving away cover

Unscrewing the screws from KEPC and

pulling out KEPC PIN

Moving away KEPC and bezel

Tear off black tape and all of ALU tape

pulling out LED-panel FFC and LVDS

Moving away main frame

Tear off black tape which to fasten wire

Unscrewing all off screws from CBPC and PWPC

Thank You !

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