HP ZHAN 66 Pro G1 Instructions de montage
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ZHAN 66 Pro G1 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB/DB
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries RTC/Battery
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Plum Screwdriver
T8
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Relax screw to disassembly RAM door
2. Relax screw to disassembly HDD door
3. Remove screw*2 to disassembly HDD assy
4. Remove screw*2 to disassembly KB
5. Remove screw*15 and FFC，Speaker connector to disassembly TOP-ASSY and base assy。
6. Remove screw*2 to disassembly SD DB
7. Removed screw*1 to disassembly battery
8. Remove USB daughter board on base assy
9. Remove screw*2 to disassembly Fan
10. Remove screw*1 to disassembly Type-C BKT
11. Remove screw*1 to disassembly Wwan module
12. Remove screw*1 to disassembly main board
13. Removed Daughter board & FFC on Top-assy：Power, TP module, Finger printer
14. Remove screw*2 to disassembly speaker assy
15. Disassembly LCD Bezel-assy with LCD Cover-assy
16. Remove screw*4 to disassembly Panel
17. Removed screw*8 to disassembly cover assy
18. Removed screw*4 to disassembly hinge
19. Removed Cable：LVDS、Antenna
20.
21.
22.
23.
24.
25.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove screw*13 to disassembly HDD, KB and base’s screw.
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