HP ZHAN 66 Pro G1 Instructions de montage

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP ZHAN 66 Pro G1 Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB/DB

Batteries

All types including standard alkaline and lithium

coin or button style batteries RTC/Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Plum Screwdriver

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Relax screw to disassembly RAM door

2. Relax screw to disassembly HDD door

3. Remove screw*2 to disassembly HDD assy

4. Remove screw*2 to disassembly KB

5. Remove screw*15 and FFC，Speaker connector to disassembly TOP-ASSY and base assy。

6. Remove screw*2 to disassembly SD DB

7. Removed screw*1 to disassembly battery

8. Remove USB daughter board on base assy

9. Remove screw*2 to disassembly Fan

10. Remove screw*1 to disassembly Type-C BKT

11. Remove screw*1 to disassembly Wwan module

12. Remove screw*1 to disassembly main board

13. Removed Daughter board & FFC on Top-assy：Power, TP module, Finger printer

14. Remove screw*2 to disassembly speaker assy

15. Disassembly LCD Bezel-assy with LCD Cover-assy

16. Remove screw*4 to disassembly Panel

17. Removed screw*8 to disassembly cover assy

18. Removed screw*4 to disassembly hinge

19. Removed Cable：LVDS、Antenna

20.

21.

22.

23.

24.

25.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Remove screw*13 to disassembly HDD, KB and base’s screw.

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2. Remove screw*6 to disassembly Top and Base.

3. Chassis part disassembly

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

4. LCD module set disassembly

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