HP TouchSmart IQ810 Instructions de montage

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP TouchSmart IQ810 PC Series

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm 10

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 6

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 3

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Description #1 M3 Screwdriver

Description #2 M2 Screwdriver

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. See attached instructions below

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Rotate unit, and put the unit on the shutter table .And

take off IO insert cover to material box.

Put stand upward , use 2#×10 5.0±0.5kgf/cm electrical

screw driver to disassemble screws then place it to

materila box.

upward totake off holder1 of cable slip and then

downward to take off holder2.

Pull plastic rear cover out.

use 2#×10 10.0±0.5kgf/cm electrical screw driver to

disassemble 4 screws on stand as pic shows. Place stand to material box.

Take L/R low rear cover in temporary area.

Pull aparts all hooks on plastic of main rear cover.

ttention: 1.Pull apart from down to up.2.Do not brea

hooks.3.Do not scratch rear cover.

Disassemble 10 screws on rear cover and 1screw on IO insert as picture. Place screws in

material box.

use electrical screw driver to disassemble 4 screws on

cable shielding R then put upward off to cable shielding

to materila box.

ttention: Becareful to move out speaker cable don'

scratch it.

use electrical screw driver to disassemble 2 screws on

cable shielding L then put upward off to cable

shielding to materila box.

Take cable shielding R&cable shielding L off and

put it in the right position.

Disassemble 17 screws on rear shied as picture ,put

them in box.

Tear cable routing tape for cable shielding L and put out

those cables form cable shielding.

1.Make sure there are no cable pressed by rear cover;

2. then disassemble rear shied metal parts from chassis.

3.put rear shied in box.

ttention:1.Do not touch the electrical components & ODD eject cable & inverter cable.

Use electric screwdriver vertically download three

screws on FOOT R,put screw into material

box.Notice:Don't mix the screw

Use electric screwdriver vertically download three

screws on FOOT L,put screw into material

box.Notice:Don't mix the screw

4 5

Put two foots in material box. pull out the AMP audio cable from the M/B corresponding

connect.

CARD READER cable F_1394 cable

Take front IO cable from unit to material box.

Pull out FRONT IO cable( like mark1&2 shows) &AMP

BOARD AUDIO cable form MB connect.

Pull out CARD READER cable and F-1394 cable from

MB.

FRONT IO

connect

ODD SATA

connect

Use electric screwdriver vertically download 2

screws on FRONT IO.

Cut 1 pcs tie-cable with nipper.and put it into the

waste parts box; pull out the camera-mic cable from the M/B

corresponding connect.

Let hot start cable&IR cable&volume button

cable&card reader cable throught from inverter

cable.

Use electric screwdriver vertically download 2

screws on card reader.

hot start cable

volume Button cable

IR cable

Pull out hot start cable&IR cable&volume button

cable from MB corresponding connect one by one.

Push IO INSERT to right side and take it off;

ttention: There are 7 hooks all outsert from unit and put it to material bo

1.To pull apart the iron from the clasp as picture

with hands,take out the iron from Card

reader,confirm the clasp not crack,not out of shape.

Take down the Card reader module from case

2 3

Disassemble 1pcs screws on C-braket and put them

into parts box.

1.Cut 1pcs cable tie with nipper and put it into the waste parts

box

2.Pull HDD power cable from MB connect out vertically. And

route HDD power cable as the yellow in PIC shown.

Put the tape(in the yellow mark as the Pic) in the material

box.Pull ODD POWER&ODD SATA&ODD EJECT out(as

the red mark) out.

1.Take HDD cage,then push HDD upside until take out HDD from base pan.

2.Put HDD in parts stocks.

Loose ODD screw with electrical screw driver.

Push ODD out from three hook as the Pic.

Take ODD&ODD SATA&ODD POWER off and put it

in the right position..

Take ODD POWER&ODD SATA&ODD

EJECT cable&inverter(thin cable) from tieing

belt.

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