HP Pavilion dv4 Instructions de montage

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Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion dv4

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Mother board 1

Batteries All types including standard alkaline and lithium coin

or button style batteries battery and RTC battery 2

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries CCFL 1

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps LCD 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Description #1 screw driver philip #1

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove battery module

2. Remove HDD & RAM & MINICARD door.

3. Remove HDD module

4. Remove expansion memory

5. Remove Mini-CARD

6. Remove ODD assembly

7. Remove Keyboard

8. Remove strip cover (with power button PCB & Capacitive PCB)

9. Divide strip assy (with speaker mesh & KB deck)

10. Remove LCD cable and antenna

11. Divide LCD assembly from base assembly

12. Divide logic-up assembly(with TP module & Speaker module) from base assembly

13. Divide M/B(with CPU and memory and thermal module) from base assembly

14. Remove Fan assembly from logic lower.

15. Remove DC IN cable wire & RJ11&Tv_tuner wire from logic-low assembly

16. Divide LCD cover & LCD bezel.

17. Divide LCD panel and Hinge Bracket.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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