EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble main battery
2. Disassemble ram door & hdd door screw*4(M2.5*6)
3. Pull out HDD Module
4. Dis-fasten Base screw(M2.5*9-2 pcs,M2.5*4-4pcs,M2.5*6-14pcs)
5. Disassemble WLAN module screw*1(M2*3)
6. Remove WLAN
7. Pull out RTC Battery cable, DC-IN cable & ODD Module
8. Remove RAM
9. Disassemble Keyboard module
10. Remove keyboard membrane
11. Pull out Speaker Cable, Disassemble Power FFC,TP FFC & TP Switch FFC
12. Dis-fasten KB Deck Plate screw*3(M2.5*6)
13. Disassemble KB Deck
14. Disassemble speaker module screw*3(M2*6)
15. Remove speaker module
16. Disassemble TP bracket*4 (M2*3)
17. Pull out LVDS cable, Mic cable, ODD cable, Bluetooth cable, USB FFC
18. Disassemble Modem card screw*2 (M2*3)
19. Disassemble mainboard screw*2(M2.5*6)
20. Disassemble FAN module screw*1(M2.5*6)
21. Remove mainboard
22. Dis-fasten hinge base screw*4 (M2.5*6)
23. Remove Display cover module
24. Remove display cover screw cover
25. Dis-fasten screw cover screw*2(M2.5*6)
26. Disassemble LCD Bezel
27. Dis-fasten hinge cap screw*2 (M2.5*5)
28. Remove hinge cap
29. Dis-fasten LCD module screw*8 (M2.5*5)
