HP ZHAN 99 Pro G1 Instructions d'installation
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ZHAN 99 Pro G1 MT
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries Lithium Coin Battery on
MB
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries NA
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps NA
0
Cathode Ray Tubes (CRT)
NA
0
Capacitors / condensers (Containing PCB/PCT)
NA
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
NA
0
External electrical cables and cords
NA
0
Gas Discharge Lamps
NA
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
NA
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
0
Components and waste containing asbestos
NA
0
Components, parts and materials containing
refractory ceramic fibers
NA
0
Components, parts and materials containing
radioactive substances
NA
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description Ph2 screw driver (Disassemble 1 pcs screws for access panel)
T15 1.5~2.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for side brkt and lower case)
T15 3.0~4.0
kgf-cm
NA
NA
Description T15 screw driver (Disassemble 2 pcs screws for PCI cover and main bkt)
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 6 pcs screws for MB and main bkt)
T15 3.0~4.0
kgf-cm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove to lower case from housing.
2. Pull off ODD SATA con &ODD power con.
3. Remove ODD from housing and loosen 4 screws to remove HDD
4. Remove front bezel from housing
5. Loosen 4 screw on side bkt then remove it
6. Pull off all cables on MB
7. Remove PCI card from housing
8. Pull off PSU con
9. Loosen 4 screws on MB then remove it
10. Loosen 3 screws on PSU then remove it
11.
12.
13.
14.
15.
16. .
17. .
18.
19.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove to lower case from housing.
2. Pull off ODD SATA con &ODD power con.
3. Remove ODD from housing and loosen 4 screws to remove HDD
4. Remove front bezel from housing
5. Loosen 4 screws on side bkt then remove it
6. Pull off all cables on MB
7. Remove PCI card from housing
8. Pull off PSU con
9. Loosen 4 screws on MB then remove it
10. Loosen 3 screws on PSU then remove it
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