HP ProDesk 400 G6 MT Instructions de montage

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 400 G6 MT

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sqcm 3

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height Delta EPA90 310W 1

External electrical cables and cords 1

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

EL-MF877-00 Page 2

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Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T-15

Micro shear

170II

Screwdriver

PH1

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Loose the screw and remove access panel.(see Figure 1 below)

2. Disconnect ODD/HDD power cable and SATA cable from ODD/HDD.(see Figure 2- 5 below)

3. Remove the driver cage from chassis.(see Figure 6 below)

4. Remove ODD/HDD from driver cage.(see Figure 7-10 below)

5. Disconnect all cables from the MB.(see Figure 11-18 below)

6. Remove the heatsink from MB.(see Figure 19 below)

7. Separate the fan from CPU heatsink.（see Figure 20-21 below)

8. Remove the Memory card from the MB.(see Figure 22 below)

9. Remove the CPU from the MB.(see Figure 23-24 below)

10. Remove the battery from the MB .(see Figure 25 below)

11. Remove M/B from chassis.(see Figure 26-28 below)

12. Remove Speaker/system fan from chassis.(see Figure 29-30 below)

13. Remove PSU from chassis.(see Figure 31-34 below)

14. Separate PSU cover/fan and remove the Electrolytic Capacitors.(see Figure 35-42 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1 Loose thumb screw and remove access panel

Figure 2 Disconnect ODD power cable from ODD

Figure 3 Disconnect SATA cable from ODD

Figure 4 Disconnect HDD Power cable from HDD

Figure 5 Disconnect SATA cable from HDD

Figure 6 Remove the driver cage from chassis

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Figure 7 Press the ODD’s latch on ODD cage

Figure 8 Remove the ODD from ODD cage

Figure 9 Use T-15 screwdriver to loose the screws of HDD

from cage

Figure 10 Remove the HDD from HDD cage

Figure 11 Disconnect SATA cable from the MB

Figure 12 Disconnect ODD/HDD PSU cables from the MB

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Figure 13 Disconnect PSU P1 cable from the MB

Figure 14 Disconnect PSU P2 cable from the MB

Figure 15 Disconnect CPU P3 cable from the MB

Figure 16 Disconnect Speaker cable from the MB

Figure 17 Disconnect system fan cable from the MB

Figure 18 Disconnect heat sink fan cable from MB

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Figure 19 Use T-15 screwdriver to loose the screws and

remove heat sink

Figure 20 Use PH1 screwdriver to loose the screws and

remove the fan

Figure 21 Separate the fan from CPU heat sink

Figure 22 Remove the Memory card from the board

Figure 23 Rotate the handle and open it up

Figure 24 Remove the CPU from the board

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Figure 25 Remove the battery from the system board

Figure 26 Use T-15 screwdriver to loose the screws of MB

from board

Figure 27 Remove front panel from chassis

Figure 28 Remove MB from chassis

Figure 29 Use T-15 screwdriver to loose the screws of

speaker and remove it

Figure 30 Use PH1 screwdriver to loose the screws of

system fan and remove it

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Figure 31 Use micro shear 170II to cut the cable ties from

chassis front wall

Figure 32 Use T-15 screwdriver to loose the screws of PSU

Figure 33 Press the PSU’s latch on chassis

Figure 34 Remove the PSU from chassis

Figure 35 Remove cover screw

Figure 36 Remove cover screw

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Figure 37 Remove cover screw

Figure 38 Cut the cable tie

Figure 39 Disconnect input wire connector

Figure 40 Disconnect fan wire connector

Figure 41 Remove 4 PCB screws

Figure 42 Remove Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in diameter or height

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