HP EliteDesk 705 G4 Instructions d'installation
EL-MF877-00
Template Revision B
Page 1
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G4 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined byEU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
ItemDescription
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies(PCA)
With a surface greater than 10 sq cm
MB, VGA card, Legacy card, Memory*4, HDMI
BOARD, SSD
9
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC
1
Mercury-containingcomponents
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
dischargelamps
0
Cathode RayTubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0
1.0 Items Requiring Selective Treatment
EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01
refractoryceramic fibers
Components, parts and materials containing
radioactivesubstances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Starscrewdriver
OD 3.3mm
Crossscrewdriver
OD 3.0mm
Crossscrewdriver
OD 6.0mm
Hexagon socket wrench
4.6mm
Description #5
3.0 Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove side panel
2.
Remove front bezel
3.
Unplug ODD & HDD cables
4.
Remove drive cage
5.
Remove FIO cage
6.
Remove ODD & HDD
7.
Release all cables
8.
Remove fan duct
9.
Remove cooler
10.
Remove CPU
11.
RemoveMemory
12.
RemoveWLAN module
13.
Remove SSD module
14.
Remove all PCIEXP cards
15.
Remove 2nd serial card
16.
Remove option card
17.
Remove card reader
18.
Remove antenna cable
19.
Remove MB and bettery
20.
Remove PSU
21.
Removespeaker
3.2
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Page 3
PSG instructions for this template are available at EL-MF877-01
1 Push thumb latch on
the chassis rear side.
Push side panel in
the end as shown,
and then pick up from
chassis as shown.
See photo 1, 2, 3, 4
Photo 1
Photo 4 Front
Push
Rear
Thumb latch will lock
on this location
Photo 3
Push
Photo 2
EL-MF877-00
Template Revision B
Page 4
PSG instructions for this template are available at EL-MF877-01
2 Release 4 bezel
latches from chassis
bypulling outwards
the bezel latches
then as shown.
See Photo 5
Pick up bezel in the
order as shown.
See Photo 6
Rotate bezel until
the bezel latches
align this line.
1
Photo 5
2
Lift up bezel away
from chassis
Photo 6
EL-MF877-00
Template Revision B
Page 6
PSG instructions for this template are available at EL-MF877-01
4 Press HDD cage first
then push button as
shown.
See Photo 8
Rotation drive cage
then pass through
HDD cables to drive
cage then remove
drive cage as shown.
See Photo 9, 10
Photo 8
2
Push button
1 Press HDD cage first
Photo 9
3
2
HDD SATA & PWR
cable pass through
to cage hole.
1
Rotate
Photo 10
Hole for cable routing
EL-MF877-00
Template Revision B
Page 7
PSG instructions for this template are available at EL-MF877-01
Photo 11
Photo 12
2
3
1Push
Photo 13
5
Pick up FIO bracket
from chassis as shown.
See Photo 11
6
Push HDD latch then
push HDD in the order
and release screws as
shown.
See Photo 12, 13
Screw tool:
Star screwdriver OD
3.3mm.
Push ODD latch then
pull ODD as shown.
See Photo 14, 15
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