HP EliteDesk 705 G1 Instructions d'installation

EL-MF877-00 Page 1

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category:

Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDesk

705

SFF

Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq

Yes

Batteries

All types including standard alkaline and lithium coin

or button style batteries Yes

Mercury

containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacito

rs / condensers (Containing PCB

/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Liteon

240W EPA92

PSU

External electrical cables and cords

YES

Gas Discharge Lamps

Plastics

containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

EL-MF877-00 Page 2

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including liquids, semi

liquids (gel/paste) and toner

chambers, and service stations.

Components

and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Micro shear

170II

Screwdriver

PH1

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the access panel.(see Figure 1 below)

2. Rotate the driver cage form the hook on slide rail.(see Figure 2 below)

3. Disconnect SATA cables from the MB.(see Figure 3 below)

4. Disconnect other PSU cables from the MB.(see Figure 4-9 below)

5. Remove HDD/ODD from chassis.(see Figure 10-16 below)

6. Remove the heatsink from MB.(see Figure17-19 below)

7. Separate the fan from CPU heatsink.（see Figure 20-21 below）

8. Remove the CPU from the MB.(see Figure 22-23 below)

9. Remove the Memory card from the MB.(see Figure 24 below)

10. Remove the battery from the MB .(see Figure 25 below)

11. Remove M/B from chassis.(see Figure 26-27 below)

12. Remove front panel from chassis.(see Figure 28 below)

13. Remove FIO/Speaker/LED holder from chassis.(see Figure 29-31 below)

14. Remove PSU cover.(see Figure 32-36 below)

15. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 37-41 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

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PSG instructions for this template are available at EL-MF877-01

Figure1 Remove the Access Panel

Figure2

Rotate the driver cage from the hook on slide rail

Figure3 Disconnect SATA cables from MB

Figure4 Disconnect the FIO cables from MB

Figure5 Disconnect Speaker cable from MB

Figure6 Disconnect ODD/HDD PSU cables from MB

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Figure7 Disconnect MB PSU cable from MB Figure8 Disconnect other PSU cables from MB

Figure9 Disconnect CPU Power cable from MB Figure10 Disconnect HDD Power cable from MB

Figure11 Disconnect SATA cable from HDD Figure12 Remove the cables from chassis clips

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Figure13 Press the HDD’s latch on HDD cage

Figure14 Remove the HDD from cage

Figure15 Press the ODD’s latch on ODD cage

Figure16 Remove the ODD from cage

Figure17 Remove the Heatsink PSU cable from MB

Figure18 Rotate the Fan duct and remove it from chassis

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Figure19 Loose the screws and remove Heat sink

Figure20 Loose the screws and remove heatsink fan

Figure21 Separate the fan from CPU heatsink

Figure22 Rotate the handle and open it up

Figure23 Remove the CPU from the board

Figure24 Remove the Memory card from the board

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Figure25 Remove the battery from the system board

Figure26 Loose the screws of MB from board

Figure27 Remove MB from chassis

Figure28 Remove front bezel from chassis

Figure29 Loose the screw of FIO and remove it

Figure30 Loose the screws of Speaker and remove them

EL-MF877-00 Page 8

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Figure31 Remove the holder of LED power cable from

chassis

Figure32 Remove Front IO cable

Figure33 Press the PSU’s latch on chassis

Figure34 Remove the PSU from chassis

Figure35 Remove screws from top

Figure36 Remove screw for bottom

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Figure37 Remove the screws and open case Figure38 Disconnect the cable-wire from product

Figure39 When removed only PCBA left Figure40 Remove Ele-Cap from PCBA

Figure 41 Show Ele-Cap on PCBA

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