HP All-in-One Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP All-in-One PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB, Webcam, converter board ,power button board

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1

2# X10

Description #2

1# X10

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Please refer to the 3.2.3 disassemble rear cover

2. Please refer to the 3.2.4 disassemble the stand

3. Please refer to the 3.2.5 disassemble Speaker

4. Please refer to the 3.2.6 disassemble HDD & ODD

5. Please refer to the 3.2.7 disassemble MB Shielding

6. Please refer to the 3.2.8 disassemble FAN Module

7. Please refer to the 3.2.9 disassemble converter board

8. Please refer to the 3.2.10 disassemble Webcam

9. Please refer to the 3.2.11 disassemble Wireless card

10. Please refer to the 3.2.12 disassemble the cables connected from MB

11. Please refer to the 3.2.13 disassemble MB and MB battery

12. Please refer to the 3.2.14 disassemble DDR

13. Please refer to the 3.2.15 separate Base pan and front bezel and panel

14. Please refer to the 3.2.16 remove Mouse/Keyboard Battery/MB

15. Please refer to the 3.2.17 remove power supply

16.

17.

18.

19.

20.

21.

22.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1, Place the system

2. Disassemble rear cover

Remove 2pcs screws with circle in red.

3. Disassemble stand

Remove 4pcs screws on both left and right so you can remove stand.

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4. Disassemble speaker

Remove 4pcs screws from left and right,

Also remove the speaker cable with in yellow circle in order to take out two speakers from system.

5. Disassemble HDD & ODD

Remove 1pcs screw with circles in red from HDD and pull backward to disengage the HDD from base pan.

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Remove 1pcs screw and push ODD forward to slide from ODD cage.

6. Disassemble MB shielding

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(1) Remove 3pcs screws with circles in red

7. Disassemble FAN Module

Remove 3pcs screws and remove the cable with in yellow circle to disassemble the fan.

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8, Disassemble converter board

Remove two cables and 2pcs screws to remove the converter board.

9, Disassemble Webcam

Remove the cable and screw in order to disengage the webcam module and mechanical parts.

10, Disassemble Wireless card

Remove one or two cables and 1pcs screw in order to remove wireless card.

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11, Disassemble the cables connected to MB and Base pan.

(1), Remove the HDD /ODD cable

Remove the cable with circles in yellow and remove 4pcs screws with circles in red.

(2) Remove LVDS cable connected from MB.

(3), Remove antenna cable on the Base pan and take away the cable.

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12. Disassemble MB and MB battery

Remove 5pcs screws to disassemble the INTEL(Daisy) MB

Pull backward the clip with in yellow circle to release the battery

13, Disassemble DDR

(1), Pull both clicks outward that holding the memory to remove the DDR.

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14, Separate Base pan and front bezel and panel

(1)Remove 14pcs screws with circles in red to separate base pan and front bezel.

(2), Remove 4pcs screws with circles in red to separate base pan and AUO/LG/CM0049 Panel

15, Remove Mouse/Keyboard Battery/MB

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

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