HP 280 G2 Small Form Factor Business Instructions de montage

EL-MF877-00 Page 1

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 280 G2 Small Form Factor Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sqcm

MB, Memory,HDD PCA,ODD PCA,PSU PCA

Batteries

All types including standard alkaline and lithium

coin or button style batteriesMB

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

system fan, Cooler fan,PSU fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1crisscross screw driver

Description #2 hexagon screw driver

T15

Description #3 electric iron

QUICK 310

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Release the screw on the access panel.

2. Remove access panel from the unit.

3. Remove front bezel from the unit.

4. Remove the heat sink cover from unit.

5. Remove HDD / ODD cable from the unit.

6. Remove ODD from the unit.

7. Remove HDD cage from the unit.

8. Remove HDD from HDD cage.

9. Remove PCA power cable and system fan cable from PCA.

10. Take out PCA from unit.

11. Remove cooler from PCA.

12. Remove memory from PCA

13. Take off PSU and system fan from the unit.

14. Open the PSU and take off the PSU fan.

15. Take off PCA from the PSU.

16. Take off CAP using electric iron..

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Release the screw on

the access panel.

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2. Remove access panel

from the unit.

Griping the tab at the end

of access panel, pull access

panel towards the rear and

remove it from unit.

3. Remove front bezel

from the unit.

Release 3 bezel latches

from chassis by pulling the

bezel latches outwards.

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1. 2.

3. 4

4. Remove the heat sink

cover from unit.

5. Remove HDD / ODD

cable from the unit.

EL-MF877-00 Page 5

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6. Remove ODD from the

unit.

7. Remove HDD cage from

the unit.

Release screw from the

HDD cage, and take out the

HDD cage from unit.

8. Remove HDD from HDD

cage.

Release 4pcs screw from

HDD cage, and take out

HDD from HDD cage.

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9. Remove PCA power

cable and system fan

cable from PCA.

10. Take out PCA from

unit.

Release 7pcs screws

from PCA, and take out the

motherboard from unit.

11. Remove cooler from

PCA.

Release 4pcs cooler screws

from PCA, and remove

cooler from PCA.

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12. Remove memory from

PCA.

13. Take off PSU and

system fan from the unit.

Release 4pcs system fan

screws from chassis, press PSU

raised and takes out PSU from

the unit.

14. Open the PSU and take

off the PSU fan.

Rotate screw driver to

release PSU cover, and

remove PSU fan.

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15. Take off PCA from the

PSU.

Rotate the screw driver to

release the PCA from PSU.

16. Take off CAP using

electric iron.

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