Haier HTVF20R72 Manuel utilisateur

附件一（1/1）

COLOUR TELEVISION

SERVICE MANUAL

Models

HTVF20R72

zFeatures

zI2CBUS CONTROL

zAUTO SEARCH 181 PROGRAM PRESETTING AND MEMOREY

zON-TIME,OFF-TIME,APPOINTING PROGRAMME

zCCD & V-CHIP

zSIDE AUDIO/VIDEO INPUT

Serial Number: 0010560520 Version:00.00 Edition: 2006-5-20

COLOR TELEVISION Model: HTVF20R72

CONTENT

1. Contents…………………………………………………………………….....1

2．Features…………………………………………………………………..2

3．SafetyPrecaution…………………………………………………….3

4．Warning and cautions………………………………………………….4

5．Net Dimension…………………………………………………………..10

6．Parts and Functions……………………………………………………11

7．Remote controller Functions…………………………………………12

8．Program Diagram……………………………………………………….13

9. Maintenance Service and Trouble Shooting……………………19

10. Circuit Diagram…………………………………………………………23

11. Circuit Explanation……………………………………………………..26

12. Adjustment……………………………………………………………….36

13. Exploded View…………………………………………………………..37

14. List of Parts………………………………………………………………38

15. Damageable Parts List…………………………………………………54

16. Information of Resistors and Capacitors………………………….55

CONTENT

2. FEATURES

FEATURES

序号 FUNCTION

1Main IC OM8377

2CRT SF picture

3Color system NTSC3.58

4Audio system M

5NO.of channels 181

6OSD language ENGLISH、FRENCH、SPANISH

PIC

Multi-picture modes Y

8AV stereo

9Super woofer

10 Surrounding sound

11 Treble/bass boost

12 Left/right balancer

13 NICAM

14 Multi-audio modes

15 Tone adjuster

16 MTS/SAP

AUDIO

Auto-volume leveling Y

18 AVinput Y

19 AVoutput

20 DVD terminal

21 S-video jack

22 Headphone socket

JIC

SCART socket

24 Digital curtain

25 Slow fading on & off

26 Semitransparent menu

27 Non-flshing channel changing

28 ZOOM

29 16:9 mode

30 Games

31 Calendar Y

32 Child-lock

33 Multi-functional lock Y

34 No-picture listening Y

35 Background light

36 Auto-timer on Y

37 CCD Y

SOFTWARE

V-CHIP Y

序号 FUNCTION

39 NO. of built-in speakers 2

40 Audio output power(W) 3W

41 Total power input（W）90W

42 Voltage range（V）120V

43 Power frequency（Hz）60HZ

44 Time of sleep timer(MINS) 120MIN

45 Net weight(KG) 23

46 Gross weight(KG) 27

47 Net dimension(MM)584X477X459

48 Packaged dimension(MM) 665X560X535

49 Quantity for 20' container

50 Quantity for 40' container

PARAMETER

Quantiry for 40' high container

52 Acquired certificate UL/FDA/FCC

53 Suitable market America

3. SAFETY PRECAUTIONS

INPORTANT SAFETY NOTICE

These parts are identified by many electrical and mechanical parts in this chassis have special

safety-related characteristics.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of the manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver whose

chassis is not isolated from the AC power line. Use a transformer of adequate power rating as

this protects the technician from accidents that might result in personal injury caused by

electrical shocks.

It will also protect the receiver and it’s components from being damaged by accidental shorts

of the circuitry that might be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a specified one.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the

resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to the high vacuum and large surface area of the picture tube, extreme care should be

taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.

X-RAY Radiation

Warning:

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the

Picture Tube.

For continued X-RAY RADIATION protection, the replacement tube must be of the same type

as specified in the Replacement Parts List.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the cabinet,

such as antennas, terminals, etc., to make sure that the set is safe to operate without any

danger of electrical shock.

SAFETY PRECAUTIONS

4．Warning and Cautions

1. When you clean the TV set, please pull

out the power plug from AC outlet. Don't

clean the cabinet and the screen with

benzene, petrol and other chemicals.

4. To prevent the TV set from firing and

electric shock, don't

make the TV set rain

or moisture.

In order to prolong the using life of the

TV set, please place it on a ventilated

place.

5. Don't open the back cover, otherwise it is

possible to damage the components in the

TV set and harm you.

Don't place the

TV set in the

sunshine or near

heat source.

6. When the TV set isn't going to be used

for long time or it is in thunder and

lightening, please pull out the plug from AC

outlet and the antenna plug from the cover

of the TV set.

Warnin

and Cautions

Figure 1

Explanation on the display tube

Generally, it is not needed to clean the tube surface. However, if necessary, its surface can be

cleaned with a dry cotton cloth after cutting off the power. Don’t use any cleanser. If using hard

cloth, the tube surface will be damaged.

CAUTION: Before servicing receivers covered by this service manual and its supplements

and addenda, read and follow the SAFETY PRECAUTIONS.

NOTE: If unforeseen circumstances create conflict between the following servicing

precautions and any of the safety precautions, always follow the safety precautions.

Remember : Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before:

a. Removing or reinstalling any component, circuit board module or any other assembly

of the receiver.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical

connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong substitution part or incorrect installation polarity of electrolytic

capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other

voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable high voltage

probe. Do not test high voltage by “drawing an arc”.

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip

lead to the degaussing or kine aquadag grounding system shield at the point where the

picture tube socket ground lead is connected, and then (b) touch the other end of the

insulated clip lead to the picture tube anode button, using an insulating handle to avoid

personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by

applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or

comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume)

isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts is not required.

6. Do not defeat any plug / socket B+ voltage interlocks with which receivers covered by this

service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all

Warning and Cautions

solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before

connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such

components are usually called Electrostatically Sensitive (ES) Devices. Examples of typical

ES devices are integrated circuits and some field effect transistors and semiconductor “chip”

components. The following techniques should be used to help reduce the incidence of

component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor- equipped

assembly, drain off any electrostatic charge on your body by touching a known earth

ground. Alternatively, obtain and wear a commercially available discharging wrist strap

device, which should be removed to prevent potential shock prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a

conductive surface such as aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type folder removal device. Some solder removal devices not

classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to

damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately

before you are ready to install it. (Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum foil or comparable conductive

material).

7. Immediately before removing the protective material from the leads of a replacement ES

device, touch the protective material to the chassis or circuit assembly into which the

device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other

safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise

even some normally harmless motions such as mutual brushing of your clothes’ fabric or

lifting of your foot from a carpeted floor might generate static electricity sufficient to damage

an ES device.)

Warning and Cautions

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will

maintain tip temperature within the range of 500 oF to 600 oF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts

lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or 1.25cm)

brush with a metal handle. Do not use freon-propelled spay-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F)

b. Heating the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal device

with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F )

b. First, hold the soldering iron tip and solder the strand against the component lead

until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the

printed circuit foil, and hold it there only until the solder flows onto and around both the

component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a

small wire-bristle brush.

Remove /Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are

inserted and then bent flat against the circuit foil. When holes are of slotted type, the following

technique should be used to remove and replace the IC. When working with boards using the

familiar round hole, use the standard technique as outlined .

Removal

Desolder and straighten each IC lead in one operation by gently prying up on the lead with the

soldering iron tip as the solder melts.

Draw away the melted solder with an anti-static suction-type solder removal device (or with

solder braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

Warning and Cautions

Carefully bend each IC lead against the circuit foil pad and solder it.

Clean the soldered areas with a small wire-bristle brush.(It is not necessary to reapply acrylic

coating to the areas).

“Small-Signal” Discrete Transistor

Removal/Replacement

Remove the defective transistor by clipping its leads as close as possible to the component

body.

Bend into a “U” shape the end of each of three leads remaining on the circuit board.

Bend into a “U” shape the replacement transistor leads.

Connect the replacement transistor leads to the corresponding leads extending from the

circuit board and crimp the “U” with long nose pliers to insure metal to metal contact then

solder each connection.

Power Output, Transistor Device

Removal/Replacement

Heat and remove all solder from around the transistor leads.

Remove the heat sink mounting screw (if so equipped).

Carefully remove the transistor from the heat sink of the circuit board.

Insert new transistor in the circuit board.

Solder each transistor lead, and clip off excess lead.

Replace heat sink.

Diode Removal/Replacement

Remove defective diode by clipping its leads as close as possible to diode body.

Bend the two remaining leads perpendicularly to the circuit board.

Observing diode polarity, wrap each lead of the new diode round the corresponding lead on

the circuit board.

Securely crimp each connection and solder it.

Inspect (on the circuit board copper side) the solder joints of the two “original” leads. If they

are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

Warning and Cautions

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections

CAUTION: Maintain original spacing between the replaced component and adjacent

components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive

that bonds foil to the circuit board causing the foil to separate from or “lift-off” the board. The

following guidelines and procedures should be followed whenever this condition is

encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a

jumper wire on the copper pattern side of the circuit board.(Use this technique only on IC

connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much

copper as absolutely necessary).

2.Carefully scratch away the solder resist and acrylic coating (if used) from the end of the

remaining copper pattern.

3.Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it around the

IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the

previously scraped end of the good copper pattern. Solder the overlapped area and clip

off any excess jumper wire.

At other connections

Use the following technique to repair the defective copper pattern at connections other than IC

Pins. This technique involves the installation of a jumper wire on the component side of the

circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to insure that a hazardous condition will not exist if the

jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest

component that is directly connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one

side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so that it does not touch components

or sharp edges.

Warnin

and Cautions

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