Fujitsu LIFEBOOK U5313X Manuel utilisateur

Page 1 of 41

System Upgrades and Repairs 2

Information on the installation and removal of components 3

Screws 4

Tools 6

Switch off the battery 7

Remove the SIM card cover 8

Insert the SIM card cover 9

Remove the pen 10

Insert the pen 11

Mandatory Support Bulletins 12

Remove the lower assy 13

Remove the battery 14

Insert the battery 15

Remove the M.2 module 17

Insert the M.2 module 18

Remove the LTE module 19

Remove the fan 20

Remove the sub board switch 21

Remove the fingerprint sensor / power button 22

Remove the speaker 23

Remove the SmartCard reader 24

Remove the touchpad buttons sub board 25

Remove the CMOS battery 26

Remove the pen garage 27

Remove the keyboard 28

Remove the mainboard / WLAN / memory 30

Remove the rear camera 31

Remove the LCD assy 32

Remove the LCD cover 33

Remove the hinges 35

LIFEBOOK U5313X 37

Additional information LIFEBOOK U5313X 38

Disposal information for recycling companies 39

Version history 41

System Upgrades and Repairs

LIFEBOOK U5313X

Version date

17.05.2023

Category

System Upgrades and Repairs

Version number

1.0

Classification

Non-classified - public

Contents

Page 2 of 41

System Upgrades and Repairs

We recommend printing out the relevant sections of this chapter prior to

installation as the device for installing/removing hardware components needs to

be switched off.

The following illustrations may differ from your device, depending on its configuration and features.

If you have received any further documents with your device, you should read these through carefully.

Please note the following instructions before installing/removing system components:

■The device must be switched off when installing/removing components and it must not be in

power-saving mode.

■Disconnect the mains plug before opening the device.

■Press on the power button for approx. 5-10 seconds in order to discharge the remaining power.

■Remove all externally connected cables.

■Take care not to pinch any cables when installing/removing components.

■Please ensure that the installed components that might heat up intensely during operation do not

exceed the permitted operating temperature.

Please take note of the target audience addressed in these instructions. Damage to the device incurred as a result of

unqualified methods used during repair work as well as the use of unsuitable spare parts or assemblies during the repair

work or upgrades of the device may void your warranty claim.

During a system expansion or a hardware upgrade, it is possible that the BIOS

must be updated. You can find more information in the technical information

provided for your device.

Page 3 of 41

Information on the installation and removal of components

These instructions provide information on disassembling the device in addition to upgrading or exchanging components.

The steps in these instructions describe the removal of a component. Installation is carried out in the reverse order.

Specifics are separately described after the removal.

Please pay attention to the locking mechanism (indentations and centring pins) when installing hardware components.

Note that some components on the mainboard may be very hot if the device was in use shortly before the case was removed.

Utmost care is required during installation and removal to avoid damaging components.

Use a non-slip base.

Never use items with sharp edges (screwdrivers) to lever them out.

Parts with Electrostatic Sensitive Devices (ESD) can be identified by a corresponding label.

When dealing with boards with ESDs, the following points must always be observed:

■

Always ensure there is a static discharge (e.g. by touching a grounded object) prior to

commencing with the work.

■

The devices and tools being used must not be statically charged.

■

Only touch the components along the edges or on the areas marked in green (contact

points).

■

Contacts and electronic components must not touch when handling components

equipped with ESD protection.