Forenex FEB710-R39 Manuel utilisateur

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FEB710-R39 User Manual

FEB710-R39/K39

ARM BOX PC

User Manual

(Preliminary)

Fanless ultra-compact

Dual Core Cortex A72+Quad core Cortex A53

ARM system for

Industrial/Advertising Applications

Version: V1.0

Document No: doc-FEB710-R39V10

PCB Bare Board: PB7968MV11

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FEB710-R39 User Manual

Packing List

1 x FEB710-R39 series BoxPC.

1 x CD includes User Manual/APIs

2 x ANTENNA, 2.4/5Ghz, 2dBi, SMA(ST. PR), bendable, 110mm.

1 x Adaptor, DC-12V/1A.

Ordering Information

Part Number: FEB710x-R/K39yz-MN

• x: Operating Temperature Type

C Commercial (0°~ 70°C).

E: Commercial Extension (-20°~ 70°C).

• y: On Board DDR3 Memory Size

1 1GB of LPDDR3.

2 2GB of LPDDR3(default).

• Z: On Board eMMC Size

4 4GB of eMMC.

8 8GB of eMMC.

F 16GB of eMMC.

• MN : The Function Summary code

SS HDMI 2.0, Micro-SD Socket, USB 3.0 (Type-A), USB2.0 (Type-A),

GigE, 5G-wifi, Line-Out, MIC-In, IR Port, Debug Port, DC-IN12V.

S1 SS - Audio Codec - Usb-HUB.

S2 S1 + Audio Codec.

S3 S1 - GigEthernet.

PS SS + 802.3at (Mode A&B, PoE+).

P1 S1 + 802.3at (Mode A&B, PoE+).

Optional Accessories

ATL- 0865 IR Receiver Module.

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FEB710-R39 User Manual

Revision histories

Rev. No.

Date

Owner

Substantial Changes

1.0

2019/09

Victor

First issue.

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FEB710-R39 User Manual

Table of Contents

1. General Information ........................................................................................................... 6

1-1. Features ................................................................................................................................. 6

1-1-1. ARM based System ............................................................................................................... 6

1-1-2. Ultra compact, Ruggedized and Fanless ............................................................................... 6

1-1-3. The Operating Temperature ................................................................................................. 7

1-1-4. Storage Expansion................................................................................................................. 7

1-1-5. Networking Option ............................................................................................................... 7

1-1-6. Power over Ethernet option ................................................................................................. 7

1-1-7. Embedded OS ready.............................................................................................................. 7

1-2. Product Specifications............................................................................................................ 8

1-3. Outline Dimensions.............................................................................................................. 10

1-4. Peripherals Port layout diagram .......................................................................................... 11

1-4-1. Front Panel.......................................................................................................................... 11

1-4-2. Rear Panel ........................................................................................................................... 11

2. Peripherals Port Description............................................................................................. 12

2-1. DC Power Jack ...................................................................................................................... 12

2-2. Power switch........................................................................................................................ 12

2-3. Power LED Indicator............................................................................................................. 12

2-4. Gigabit Ethernet Port ........................................................................................................... 12

2-5. USB 2.0 Port ......................................................................................................................... 13

2-6. USB 3.0 Port ......................................................................................................................... 13

2-7. Micro SD/SDHC card Slot ..................................................................................................... 14

2-8. MIC with 3.5 mm Stereo Jack............................................................................................... 14

2-9. Line Out with 3.5mm Stereo Jack ........................................................................................ 14

2-10. IR receiver with 3.5mm Stereo Jack(Option) ....................................................................... 14

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FEB710-R39 User Manual

2-11. HDMI®-2.0 port .................................................................................................................... 15

2-12. RS232 Debug Port ................................................................................................................ 16

2-13. GPIOs Port (Option) ............................................................................................................. 16

3. Software and Technical Supports ..................................................................................... 17

3-1. Android Programming Guide ............................................................................................... 17

3-1-1. ADB installation........................................................................................................... 17

3-1-2. To install APK software over the ADB function of PC :................................................ 20

3-1-3. GPIO installation.......................................................................................................... 20

3-2. Linux Programming Guide.................................................................................................... 21

3-2-1. GPIOs installation ........................................................................................................ 21

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FEB710-R39 User Manual

1.General Information

Forenex's FEB710 Box-PC is an ultra-compact solution designed to take full advantage

of the lowest power, fanless system design and embed powerful graphic engines provide

optimized performance on supporting multi-format video decoders including

H.264/H.265/VP9up to4Kx2K, especially, H.264/H.265 decoders support 10bits coding, and

also supports H.264/MVC/VP8 encoders by 1080p@30fps, high-quality JPEG

encoder/decoder, and embedded 3D GPU makes FEB710 completely compatible with

OpenGL ES1.1/2.0/3.0/3.1, OpenCL and DirectX 11.1. Special 2D hardware engine will

maximize display performance and provide very smooth operation.

The FEB710 is very suitable for a variety of industrial transportation, selling

infotainment, self-ordering machine (HMI) and TV advertisement applications.

The heart of the FEB710-RK39 Box-PC is the Rockchip3399 ARM Cortex A72+A53

processor which provides all of the necessary interfaces for connecting peripherals such as:

-Networking: RJ45 Gigabit Ethernet port, SDIO Wi-Fi(WLAN) connectivity.

-Serial port: USB 3.0 Type-A, USB 2.0 Type-A, and Debug port.

-Display: HDMI® 1.4 port.

-Audio: Stereo Line-out Jack, MIC-in Jack.

-Expansion storage & GPIO: Micro SD slot, DIO port.

-Others: power LED

1-1. Features

1-1-1. ARM based System

With Arm Cortex®-A72 + Cortex®-A53 platform is a powerful Android/ Linux-based solution,

offering high performance processing optimized for the lowest power consumption.

1-1-2. Ultra compact, Ruggedized and Fanless

The FEB710-RK39 fanless system is 207.8mm (W) x 118.2 (D) x 25mm (H), ruggedized chassis

which is suitable to install in critical environment and to ensure maximum reliability.

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FEB710-R39 User Manual

1-1-3. The Operating Temperature

Provide a wide range from 0°C up to 70°C, suitable for critical environment applications.

**Note: The Operating Temperature is a result of the test performed in experimental

chamber. It is highly suggested to execute a solid testing under actually application

environment.

1-1-4. Storage Expansion

The Micro SD/SDHC card slot enables the FEB710-RK39 to have a flexible storage up to 32GB

size.

**Note: More frequent and larger data access on eMMC memory makes the eMMC

lifespan shorter. Therefore, it is highly recommended to use a Micro SD card for large data

access.

1-1-5. Networking Option

The FEB710-RK39 equips with RJ-45 port that supports high-speed Gigabit Ethernet.

And a 2.4G/5Ghz, Wi-Fi (WLAN): IEEE 802.11a/b/g/n/ac 2x2 MIMO standard with SDIO

interface on board.

1-1-6. Power over Ethernet option

The optional 802.3at module (PoE+) is Powered Device (PD) controller and switching

regulator for high power IEEE 802.3at and 802.3af applications. The (Max.) power output is

25W and can be operated with an external adapter (12V) together.

1-1-7. Embedded OS ready

Android 7.1

Debian 9

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FEB710-R39 User Manual

1-2. Product Specifications

Processor:

Rockchip3399 Arm Cortex®-A72 + Cortex®-A53

System Memory:

1GB/2GB(default) LPDDR3L-1600 SDRAM

Storage:

4GB/8GB(default)/16GB eMMC Flash memory

Graphics:

ARM Mali-T860MP4 (Embedded 3D GPU)

Supports completely compatible with OpenGL ES1.1/2.0/3.0/3.1, OpenCL, DX11

Supports AFBC (ARM Frame Buffer Compression)

Video Decoder:

-H.264 /H.265, 10bit, up to 4Kx2K@60fps

-VP9, 8bit, up to 4Kx2K@60fps

-MPEG-4 /MPEG-2 /VP8 up to 1080p@60fps

Video Encoder:

-H.264 /MVC /VP8 encoders by 1080p@30fps

Supports HDMI® V2.0, Res. up to 4Kx2K @60fps, HDCP1.4 /2.2

LAN:

Realtek RTL8211E Gigabit Ethernet transceiver with RGMII support

WLAN:

2.4G/5Ghz, Wi-Fi module with SDIO interface on board. The wireless module

complies with IEEE 802.11a/b/g/n/ac 2x2 MIMO standard

Audio:

Realtek ALC5640 high performance, low power stereo codec

USB:

Original from processor, with 1 x USB3.0 and 1 X USB2.0

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FEB710-R39 User Manual

Front Panel I/O:

1 x DC Power Jack

1 x Power LED

1 x Gigabit Ethernet Port (supports optional IEEE 802.3at, PoE+)

1 x Micro-SD Card Slot

1 x USB 2.0 Type A

1 x USB 3.0 Type A(Bunning Port)

1 x HDMI

Rear Panel I/O:

2 x Antenna holes for 5G/Wi-Fi

1 x Power Switch

1 x Debug Port

3 x 3.5mm, Audio Jack for Line-Out,MIC-In, IR Receiver(Option)

1 x GPIO Port(option)

Dimension (W x D x H):

207.8mm x 118.2mm x 25mm (8.2” x 4.7” x 1”)

Weight:

600mg

Operating Temperature:

0°C ~ 70°C (FEB710C-R39 series)

-20°C ~ 70°C (FEB710E-K39 series)

Operating Humidity:

0% ~ 90% @ 45°C (non-condensing)

Operating System:

Android 7.1

Debian 9

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FEB710-R39 User Manual

1-3. Outline Dimensions

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