Ebyte E10-433MD3 Manuel utilisateur

E10-433MD3 User Manual

SI4438 433MHz 100mW SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

Contents

Disclaimer.............................................................................................................................................................................. 2

1 Overview............................................................................................................................................................................. 3

1.1 Brief introduction........................................................................................................................................................... 3

1.2 Feature...................................................................................................................................................................... 3

1.3 Application................................................................................................................................................................3

2 Specification and parameter............................................................................................................................................. 4

2.1 Limit parameter.........................................................................................................................................................4

2.2 Operating parameter................................................................................................................................................. 4

3 Size and pin definition....................................................................................................................................................... 5

4. Basic operation..................................................................................................................................................................6

4.1 Hardware design....................................................................................................................................................... 6

4.2 Software editing........................................................................................................................................................6

5 Basic application..........................................................................................................................................................7

5.1 Basic circuit diagram................................................................................................................................................ 7

6 FAQ..................................................................................................................................................................................... 7

6.1 Communication range is too short............................................................................................................................ 7

6.2 Module is easy to damage.........................................................................................................................................8

6.3 BER(Bit Error Rate) is high...................................................................................................................................8

7 Production guidance.......................................................................................................................................................... 8

7.1 Reflow soldering temperature...................................................................................................................................8

7.2 Reflow soldering curve.............................................................................................................................................9

8 E10 Series............................................................................................................................................................................9

9 Antenna guidance............................................................................................................................................................ 10

9.1 Antenna recommendation....................................................................................................................................... 10

10 Package method for bulk order....................................................................................................................................11

Revision history...................................................................................................................................................................11

About us............................................................................................................................................................................... 11

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

1 Overview

1.1 Brief introduction

E10-433MD3 is small SMD wireless module working at

433MHz developed based on chip SI4438 from Silicon Labs.

Due to the use of the imported Si4463 as the core of the module,

its stability has been well received by users, and compatibility is not

a concern. The module is aimed at smart home, wireless meter

reading, scientific research and medical, and medium and long

distance wireless communication equipment. Since RF performance

and component selection are in accordance with industrial standards,

and the product has obtained FCC, CE, RoHs and other international

authoritative certification reports, users do not need to worry about

its performance. With its stable and reliable characteristics, it is favored by the majority of users. Compared with the old

products, it has made great progress in receiving current, receiving sensitivity, transmitting power, receiving rate range

and anti-interference ability. High precision 26MHz crystal is used.

Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.

1.2 Feature

Communication distance tested is up to 2km

Maximum transmission power of 100mW, software multi-level adjustable；

Support the global license-free ISM 433MHz band；

Support air date rate of 1.2kbps～1000kbps；

Support multiple modulation methods, (G)FSK, 4(G)FSK, (G)MSK，OOK ；

Support 64/128 byte Transceiver Data Register (FIFO)

Support 2.5V~3.6V power supply, power supply over 3.3 V can guarantee the best performance；

Industrial grade standard design, support -40 ~ 85 °C for working over a long time；

SMA connector, good for connecting external antenna..

1.3 Application

Home security alarm and remote keyless entry；

Smart home and industrial sensors；

Wireless alarm security system；

Building automation solutions；

Wireless industrial-grade remote control；

Health care products；

Advanced Meter Reading Architecture(AMI)；

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

2 Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min.

Max.

Power supply（V）

3.6

Voltage over 3.6V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules are

used in short distance

Operating temperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operating voltage（V）

1.8

3.3

3.6

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

Industrial design

Operating frequency（MHz）

425

433

525

Support ISM band

Power

consumpti

TX current（mA）

Instant power consumption

RX current（mA）

Sleep current （μA）

0.6

Software is shut down

Max Tx power（dBm）

Receiving sensitivity（dBm）

-124

-126

-128

Air data rate is 1kbps

Air data rate（bps）

0.123k

Controlled via user’s programming

Main parameter

Description

Remark

Distance for reference

2000m

Test condition：clear and open area, antenna gain: 5dBi，antenna

height: 2.5m，air data rate: 1kbps

FIFO

64Byte

Max length transmitted each time

Crystal frequency

26MHz

Modulation

GFSK

(recommended)

(G)FSK, 4(G)FSK, (G)MSK，OOK

Package

SMD

Connector

2.00mm

Communication interface

SPI

0-10Mbps

Size

18.1 * 22.1mm

Antenna

IPEX

50 ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

3 Size and pin definition

No.

Name

Direction

Function

GND

Ground

SDN

input

Shutdown Input Pin. It is low level when working

(See SI4463 manual for more details)

nSEL

input

SPI Chip select for starting SPI communication

MOSI

input

SPI master output slave input

GND

Ground

MISO

output

SPI master input slave output

SCK

input

Serial Clock Input

IRQ

output

SPI interrupt request

GPIO1

input/output

GPIO（see more from SI4463 datasheet）

GPIO0

input/output

GPIO（see more from SI4463 datasheet）

VCC

Power supply ：1.8~ 3.6 V DC, 3.3V is recommended

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded.；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged；

Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation.；

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference.；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the

copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of

the module and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done.

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)；

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside；

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.2 Software editing

GPIO0 \ GPIO1 \ GPIO2 \ GPIO3 are configurable I/O ports for various application ，see more in SI4438

datasheet.It can be floated when not used.

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

IRQ pin can also be disconnected. The SPI query mode can be used to obtain the interrupt status. However, it is

recommended to use the external interrupt of the MCU.

SPI communication rate should not be set too high, usually around 1Mbps.

Please refer to “Operating Modes and Timing” for SI4463 status switch，the switch between TX and RX should be

through Ready, can not be switched directly.

Re-initialize register configuration when the chip is idle for higher stability.

For controlling GPIO2 ,GPIO3 externally，pin status is as follows：

In tx mode：GPIO2 = 0; GPIO3 = 1;

In rx mode：GPIO2 = 1; GPIO3 = 0;

If the SI4463 is required to control itself, the mode of the configuration pins can be as follows when

the program is initialized:

SI44XX_GPIO_CONFIG( 0, 0, 32|0x40, 33|0x40, 0, 0, 0 );

5 Basic application

5.1 Basic circuit diagram

6 FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists.

Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

distance).

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power.

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;

7 Production guidance

7.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid phase line

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

Aveage ramp-down rate

6℃/second max

Time 25℃ to peak temperature

Time to peak temperature for

25℃

max 6 minutes

max 8 minutes

Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MD3 User Manual

7.2 Reflow soldering curve

8 E10 Series

Model No.

Frequency

(Hz)

Tx power

(dBm)

Test distance

Package

Antenna

E10-868MS30

SI4463

868M

SMD

Stamp hole/IPEX

E10-915MS20

SI4463

915M

2.5

SMD

Stamp hole/IPEX

E10-868MS20

SI4463

868M

2.5

SMD

Stamp hole/IPEX

E10-433MS1W

SI4463

433M

SMD

Stamp hole

E10-433MD3

SI4438

433M

SMD

IPEX

E10-433MD-SMA

SI4463

433M

DIP

SMA-K

E10-433MS

SI4463

433M

SMD

Stamp hole

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