Ebyte E01-2G4M27SX Manuel utilisateur

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M27SX User Manual

E01-2G4M27SX User Manual

nRF24L01+ 2.4GHz 500mW SPI SMD wireless module

Chengdu Ebyte Electronic Technology Co., Ltd E01-2G4M27SX User Manual

Content

1. Overview.....................................................................................................................................................................2

1.1 Brief Introduction............................................................................................................................................. 2

1.2 Features.............................................................................................................................................................2

1.3 Application........................................................................................................................................................2

2. Specification and parameter....................................................................................................................................... 3

2.1 Limit parameter.................................................................................................................................................3

2.2 Operating Parameter......................................................................................................................................... 3

3. Size and pin definition................................................................................................................................................ 5

4. Basic operation............................................................................................................................................................6

4.1 Hardware design............................................................................................................................................... 6

4.2 Software writing............................................................................................................................................... 6

4.3 Power binning...................................................................................................................................................7

5. Basic application.........................................................................................................................................................7

5.1 Basic circuit...................................................................................................................................................... 7

6. FAQ.............................................................................................................................................................................8

6.1 Communication range is too short....................................................................................................................8

6.2 Module is easy to damage................................................................................................................................ 8

6.3 BER(Bit Error Rate) is high............................................................................................................................. 8

7. Welding operation guidance....................................................................................................................................... 9

7.1 Reflow soldering temperature.......................................................................................................................... 9

7.2 Reflow soldering curve.....................................................................................................................................9

8. Related models..........................................................................................................................................................10

9. Antenna guidance......................................................................................................................................................10

9.1 Antenna recommendation............................................................................................................................ 10

10. Packing method for batch order..............................................................................................................................11

Revision history............................................................................................................................................................ 11

About us........................................................................................................................................................................ 11

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

1. Overview

1.1 Brief Introduction

E01-2G4M27SX is a 2.4GHz SMD wireless module with ultra-small size

and maximum transmit power of 500mW independently developed based on

nRF24L01P produced by Nordic in Norway.

The original imported nRF24L01P is used to ensure its compatibility. On the

original basis, a power amplifier (PA) and a low noise amplifier (LNA) are built in,

so that the maximum transmit power reaches 500mW and the receiving sensitivity

is further improved. The overall communication stability is greatly improved

compared to products without power amplifiers and low noise amplifiers.

This product uses industrial grade high precision 16MHz crystal.

Because E01-2G4M27SX is a pure RF transceiver module, users need to use the MCU driver or use a dedicated

SPI debugging tool.

1.2 Features

Ultra-small volume, only 18 * 14.5mm;

Maximum transmission power of 500mW, software multi-level adjustable;

Under ideal conditions, the communication distance can reach 4 km;

Support global license-free ISM 2.4GHz band;

Support air date rate of 2Mbps, 1Mbps, 250kbps;

125 communication channels to meet the needs of multi-point communication, grouping, frequency hopping, etc.

Connect with MCU through SPI interface, the rate is 0～10 Mbps;

Support2.3～3.6V power supply, power supply over 3.3V can guarantee the best performance；

Professional RF shield, anti-interference, anti-static;

IPEX interface, can be easily connected to coaxial cable or external antenna (shared by IPEX interface);

Enhanced ShockBurst is fully compatible with all nord24n series, nRF24E series, nRF24U series of NORDIC.

1.3 Application

Smart home and industrial sensors;

Security system, positioning system；

Wireless remote control, drone；

Wireless game remote control；

Healthcare products；

Wireless voice, wireless headset；

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

2. Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min.

Max.

Power supply（V）

2.3

3.6

Voltage over 3.6 V will cause permanent

damage to module

Operating temperature（℃）

-40

+85

Industrial grade

2.2 Operating Parameter

Main parameter

Performance

Remark

Min.

Typ.

Max.

Operating voltage（V）

2.3

3.3

3.6

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning

down

Operating temperature（℃）

-40

+85

Industrial design

Operating frequency（GHz）

2400

2525

Support ISM band

Power

consumption

TX current（mA）

720

Instant power consumption

RX current（mA）

Sleep current （μA）

Does not support low power mode

Max Tx power（dBm）

Receiving sensitivity（dBm）

-113

-114

-115

Air data rate is 250 kbps

Air data rate（bps）

250 k

2 M

Controlled via user’s programming

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

Main parameter

Description

Remark

Distance for reference

4 km

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 250kbps

FIFO

32 Byte

Max length transmitted each time

Crystal frequency

16 MHz

Modulation

GFSK

Package

SMD

Connector

1.27 mm pin

Communication interface

SPI

0～10 Mbps

Size

18*14.5 mm

RF interface

IPEX

50ohm impedance

Weight

1.0±0.1g

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

3. Size and pin definition

Pin No.

Pin item

Pin direction

Pin application

VCC

Power supply must be 2.3 ~ 3.6V

Input

Module control pin

CSN

Input

The chip select pin of the module is used to start an SPI

communication.

SCK

Input

Module SPI bus clock

MOSI

Input

Module SPI data input pin

MISO

Output

Module SPI data output pin

IRQ

Output

Module interrupt signal output, low level is effective.

GND

Ground wire, connect to power reference ground.

GND

Ground wire, connect to power reference ground.

GND

Ground wire, connect to power reference ground.

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded.

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module.

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged；

Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation.；

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and

other parts with large electromagnetic interference.；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the

copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of

the module and routed in the Bottom Layer；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom

Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done.

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna

is exposed, preferably vertically. When the module is installed inside the chassis, you can use high-quality antenna

extension cords to extend the antenna to the outside of the chassis;

The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.

4.2 Software writing

This module is nRF24L01+PA+LNA, and its driving method is completely equivalent to nRF24L01+, users can

operate in accordance with nRF24L01+ chip manual (see nRF24L01P manual for details);

IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response, etc.; it can be

disconnected, and the interrupt status can be obtained by SPI query (not recommended, which is not conducive to

the overall power consumption and the efficiency is low);

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

CE can be connected to high level for a long time, but the module must first be set to POWER DOWN power-down

mode when writing the register. It is recommended that CE be controlled by the single-chip pin;

The CE pin is connected to the LNA enable pin. When CE=1, the LNA is turned on, and when CE=0, the LNA is

turned off. This operation is a transceiver mode of nRF24L01;

If the user needs to answer automatically, the CE pin must maintain a high level during the transmission process,

instead of the high-level time mentioned in the nRF24L01+ manual greater than 10us. The correct operation is:

CE=1 triggers the transmission. After knowing that the transmission is completed, it will set CE=0, instead of CE=0

after 10us. The reason is: after L01+ transmission, it will immediately switch to the receiving mode. If CE= 0, the

LNA has been turned off, which is not conducive to receiving sensitivity.

4.3 Power binning

5. Basic application

5.1 Basic circuit

No.

nRF24L01P setting power (dBm)

Module output power (dBm)

0dBm

27dBm

-6dBm

25dBm

-12dBm

22dBm

-18dBm

14dBm

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

6. FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists.

Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance).

The low voltage of the power supply is lower than the recommended value at room temperature, the lower the

voltage, the lower the power;

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply to ensure that it is between the recommended power supply voltage, if exceeding the

maximum value will cause permanent damage to the module;

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus

trace should not be too long;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;

Chengdu Ebyte Electronic Technology Co.,Ltd. E01-2G4M27SX User Manual

7. Welding operation guidance

7.1 Reflow soldering temperature

Profile Feature

Curve characteristics

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Solder paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

Min preheating temp.

100℃

150℃

Preheat temperature max (Tsmax)

Mx preheating temp.

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

Preheating time

60-120 sec

Average ramp-up rate(Tsmax to Tp)

Average ramp-up rate

3℃/second max

Liquidous Temperature (TL)

Liquid phase temp.

183℃

217℃

Time（tL）Maintained Above（TL）

Time below liquid

phase line

60-90 sec

30-90 sec

Peak temperature（Tp）

Peak temp.

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

Aveage ramp-down

rate

6℃/second max

Time 25℃ to peak temperature

Time to peak

temperature for 25℃

6 minutes max

8 minutes max

7.2 Reflow soldering curve

图7-1 回流焊曲线图

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