Dell SE2219H Manuel utilisateur

DELL SE2219H, SE2419H

1. Disassemble Procedures

Turn off power

Unplug cables from monitor.

Press upper edge of the back cover (start with top

of monitor) with both thumbs, the rest 4 fingers

pull back cover upwards. Repeat the action 2-8

position to remove back cover.

Remove stand from monitor release button

(with Philip-head screwdriver)

Remove 2 aluminium foil (#1 as yellow) and 2

acetate tape (#2 & #3 as green).

Remove Keypad cable & Backlight cable (#4 & #5

as blue).

Use Hexgonal screwdriver to remove 2 VGA

screws 4-40 x 11.8 (#6 & #7). Torque: 4.5 +/-

0.5Kgf.cm

Use Philips-head screwdriver (Φ5 mm) to remove

2 metal frame screws M3*5 (#8 & #9). Torque: 4.5

+/- 0.5Kgf.cm

Use Philips-head screwdriver (Φ5 mm) to

remove 2 screws for unlocking.

M4 x 4.5, Torque = 12 +/- 1Kgf.cm

Remove 1 aluminium foil & unplug LVDS cable.

DELL SE2219H, SE2419H

Flip chassis, remove mylar.

Use Philips-head screwdriver (Φ5 mm) to

remove PCBAs screws.

M3 x 5 & M3 x 6 for ground screw.

Torque = 6.0 kgf +/-0.5 kgf

S10

Use Philips-head screwdriver (Φ3 mm) to remove

3 screws from mid frame (to disassemble front

trim).

T2 x3. Torque: 1.0 +/- 0.1Kgf.cm

Remove cables from IF & power board.

S11

Remove electrolyte capacitor >25mm height (red

mark) from printed circuit boards.

Cut the glue between bulk cap and PCBA with

knife –ensure cutting path within the glue, don’t

touch bulk cap and PCBA.

Use Philips-head screwdriver (Φ3 mm) to

remove 11 screws from mid-frame

M3 x 4. Torque: 3.5 +/- 0.5Kgf.cm

S12

Take out the capacitor pin solder with soldering

iron.

Lift the bulk capacitor away from power board.

DELL SE2219H, SE2419H

2. Product Material Information

The following substances, preparation, or components should be disposed of or recovered separately

from other WEEE in compliance with Article 4 of EU Council Directive 75/422/EEC.

Capacitors / Condensers (containing PCB/PCT)

Not used

Mercury containing components

Not used

Batteries

Not used

Printed circuit boards (with surface greater than 10

square cm)

Product has printed circuit boards (with surface

greater than 10 square cm)

Component contain toner, ink and liquids

Not used

Plastic containing BFR

Component and waste contain asbestos

Not used

CRT

Not used

Component contain CFC, HCFC, HGC and HC

Not used

Gas discharge lamps

Not use

LCD display > 100 cm2

Product LCD greater than 100cm2

External electric cable

Product has external cables

Component contain refractory ceramic fibers

Not used

Component contains radio-active substances

Not used

Electrolyte capacitors (height > 25mm,

diameter >25mm)

Product has electrolyte capacitors (height > 25mm)

3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the product to a point

where components and materials requiring selective treatment can be removed.

Tool Description:-

-Screwdriver (Philip head with Φ5 mm & Φ3 mm)

-Screwdriver (Hexgonal to remove VGA connectivity)

-Soldering iron

-Knife

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