Dell AW2521Hb Manuel utilisateur

ELL

21H

1. Disassembly Procedures

S1 Turn off power

S2 Place the monitor on a soft cloth or

cushion

Carefully slide and remove the I/O

cover from the monitor.

S3 Disconnect the cables from the monitor

and slide them out through the cable-

management slot on the stand riser

S4 Press and hold the stand release button

S5 Lift the stand up and away from the

monitor.

S6 Unlock 4 screws on rear cover

Use hands or scraper bar to

disassemble Rear Cover from the

monitor.

Notice the disassembly order:

Left Side=> Top Side=>Right

Side=>Bottom Side

(Screw Torque: 8-10 kgf)

S7 Remove USB FFC and Audio FFC from

I/F BD

S8 Disconnect LED Driver BD wire and

CTRL FFC cable from I/F BD

Take off Rear Cover

ELL

S9 Tear off a tape from CTRL FFC cable

on Rear Cover

S10

Remove all cables from LED Driver BD

Unlock 1 screw and disassemble LED

Driver BD from Rear Cover

(Screw Torque: 4.5±0.5 kgf)

S11

Tear off an adhesive tape from LED BD

wire on Rear Cover

S12

Tear off “MYLAR HEAD LOGO” from

cover LOGO LENS

S13

Disconnect LED BD wire from LED BD

Disassemble LED BD from Rear Cover

S14

Remove a conductive foam from

conductive cloth

S15

Remove a conductive cloth from the

right USB screw and Rear Cover

S16

Unlock 2 screws to disassemble USB

BD from Rear Cover

(Screw Torque: 4.5±0.5 kgf)

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21H

S17

Disconnect USB FFC and Audio FFC

from USB BD

S18

Remove FFC cable from Rear Cover,

CTRL BD and CTRL+KEY BD

Unlock 6 screws to disassemble CTRL

BD and CTRL+KEY BD from Rear

Cover

(Screw Torque: 2.0±0.5 kgf)

S19

Tear off 6 tapes on Backlight Wire

Disconnect Backlight Wire from I/F BD

S20

Disconnect “CTRL+LENS BD FFC”

from I/F BD and remove it from Panel

and Main SHD

S21

Disconnect Light Sensor BD FFC from

I/F BD and remove it from Panel and

Main SHD

ELL

S22

Unlock MF screw*16 to disassemble

the Middle Frame from Panel (Yellow

Mark)

Unlock 4 screws to disassemble Main

SHD from Panel (Blue Mark)

(Screw Torque-MF: 4.5±0.5 kgf)

(Screw Torque-Main SHD: 4.0±0.5 kgf)

S23

Tear off an acetate tape and a tensile

tape from EDP cable

S24

Disconnect EDP cable from Panel

Take off Main SHD from Panel

S25

Tear off the adhesive tape from the

connector of Backlight wire

Disconnect Backlight Wire from Panel

S26

Disassemble Light Sensor BD from

Middle Frame

S27

Unlock 2 screws to disassemble Power

Button module from Middle Frame

(Screw Torque:1.1±0.1kgf)

S28

Disconnect FFC cable from

“CTRL+LENS BD” (Power CTRL BD)

S29

Tear off “MYLAR PWR-LENS“ from

“CTRL+LENS BD” (Power CTRL BD)

S30

Unlock 2 screws to disassemble

“CTRL+LENS BD” (Power CTRL BD)

from Power Button

(Screw Torque: 2±0.5kgf)

ELL

21H

S31

Unlock 1 screw to disassemble Docking

BD from Main SHD

Disassemble wire from Docking BD

(Screw Torque: 8.5±1.0kgf)

S32

Disassemble Safety mylar from Main

SHD

S33

Tear off an adhesive tape from EDP

cable on I/F BD

Disconnect EDP cable from I/F BD

Unlock 9 PCBA screws to disassemble

I/F BD and SPS BD

(Screw Torque: 8.5±1kgf)

S34

Disassemble I/F BD and SPS BD from

Main SHD

S35

Disconnect I/F BD to Docking BD wire

from I/F BD

Disconnect wire from I/F BD and SPS

S36

Disconnect Fan Cable from I/F BD

S37

Unlock 4 screws to disassemble G-

SYNC+Heatsink Module from I/F BD

(Screw Torque: 4.0±0.5 kgf)

ELL

S38

Remove electrolyte capacitors (red mark) from printed circuit boards

S38-1 Cut the glue between bulk cap. and PCB with a knife

S38-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB

ELL

21H

S38-3 Take out bulk cap. pin solder with soldering iron and absorber

S39-4 Lift the bulk cap. up and away from the PCB

ELL

2. Product material information

The following substances, preparations, or components should be disposed of or

recovered separately from other WEEE in compliance with Article 4 of EU Council

Directive 75/442/EEC.

Capacitors / condensers (containing

PCB/PCT)

No used

Mercury containing components

No used

Batteries

No used

Printed circuit boards (with a surface greater

than 10 square cm)

Product has printed circuit boards

(with a surface greater than 10 square

cm)

Component contain toner, ink and liquids

No used

Plastic containing BFR

No used

Component and waste contain asbestos

No used

CRT

No used

Component contain CFC, HCFC, HFC and

No used

Gas discharge lamps

No used

LCD display > 100 cm2 Product has an LCD greater than 100

cm2

External electric cable

Product has external cables

Component contain refractory ceramic fibers

No used

Component contain radio

active substances

No used

Electrolyte capacitors (height

> 25mm, diameter > 25mm)

Product has electrolyte capacitors

(height >25mm, diameter > 25mm)

3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the

product to a point where components and materials requiring selective treatment can be

removed.

Tool Description:

- Screwdriver

- Scraper Bar

- Penknife

- Soldering iron and absorber

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