Celera Motion MicroE ChipEncoder Series Manuel utilisateur

125 Middlesex Turnpike | Bedford, MA 01730-1409 USA

IM-ChipEncoder-Series-Rev. 2 Tel: 781-266-5700 | celeramotion@gsig.com

ChipEncoder™

Series

Installation Manual and

Reference Guide

Introduction

ChipEncoder Series

Installation Manual and Reference Guide

Table of Contents

1.0 Introduction.......................................................................................................................................2

1.1 Overview .............................................................................................................................2

1.2 Precautions .........................................................................................................................2

1.3 Laser Safety Information.....................................................................................................2

1.4 Standards Compliance........................................................................................................3

1.5 Related Documentation.......................................................................................................3

1.6 Manual Revisions................................................................................................................3

1.7 Trademarks.........................................................................................................................3

1.8 Special Conventions Used..................................................................................................3

2.0 Before Installation.............................................................................................................................4

2.1 Power Recommendations...................................................................................................4

2.2 Installation Considerations..................................................................................................4

2.3 Handling Considerations.....................................................................................................4

2.4 Solder Paste Recommendation and Reflow Profile............................................................5

2.5 Application Notes ................................................................................................................6

2.6 Installation Flowchart...........................................................................................................7

3.0 System Overview .............................................................................................................................8

3.1 ChipEncoder Models...........................................................................................................8

3.2 Linear and Rotary Glass Scales..........................................................................................9

3.3 Evaluation PCB...................................................................................................................9

4.0 ChipEncoder Installation ................................................................................................................10

4.1 Mounting Orientation and Tolerances...............................................................................10

4.2 Mounting the ChipEncoder................................................................................................11

4.2.1 Linear Scale Installation.......................................................................................11

4.2.2 Rotary Scale Installation ......................................................................................12

4.3 Encoder Alignment............................................................................................................13

5.0 Linear Glass Scale Installation.......................................................................................................14

5.1 Before Installation..............................................................................................................14

5.1.1 Items Required for Linear Glass Scale Installation..............................................14

5.1.2 Flowchart for Linear Glass Scale Installation.......................................................14

5.2 Prepare Mounting Surface ................................................................................................15

5.3 Position the Scale..............................................................................................................15

5.4 Mounting the Scale............................................................................................................16

5.4.1 Epoxy Mounted Scale ..........................................................................................16

5.4.2 Adhesive Tape Mounted Scale ............................................................................17

6.0 Cleaning Scales .............................................................................................................................17

7.0 Appendix ........................................................................................................................................18

7.1 Specifications ....................................................................................................................18

7.2 Output Signals Descriptions..............................................................................................19

7.3 Linear and Glass Scales ...................................................................................................20

7.4 Electrical Schematics........................................................................................................22

7.5 Evaluation Board...............................................................................................................24

7.6 Recommended Signal Termination...................................................................................26

7.7 Customer Interface............................................................................................................26

7.8 RS-422 Compatibility.........................................................................................................26

7.9 Troubleshooting.................................................................................................................27

8.0 Order Guide....................................................................................................................................28

9.0 Contacting Celera Motion...............................................................................................................29

Introduction

ChipEncoder Series

Installation Manual and Reference Guide

1.0 Introduction

1.1 Overview

The ChipEncoder is an encoder system on a chip:

Small enough to mount directly on a printed circuit board

Designed for high-volume applications

Compatible with low-cost automated assembly processes

The instructions in this manual apply to the following ChipEncoders models:

Models CE300-4, CE300-40

Model CE40-GC

1.2 Precautions

1. Follow standard ESD precautions. Turn power to off before connecting the

sensor.

2. Do not touch electrical pins without static protection such as a grounded wrist

strap.

1.3 Laser Safety Information

This product is sold solely for use as a component (or replacement) in an electronic product; therefore, it

is not required to, and does not comply with U.S. FDA 21 CFR 1040.10 and 1040.11 which pertain to

complete laser products. The manufacturer of the complete system-level electronic product is

responsible for complying with 21 CFR 1040.10 and 1040.11.

MicroE Systems encoders contain an infrared laser diode or diodes. Emitted invisible laser radiation

levels have been measured to be within the CDRH Class 1 range, which is not considered hazardous;

however, to minimize exposure to the diverging beam, install the encoder sensor in its operational

configuration in close proximity to the encoder scale before applying power.

Invisible laser radiation: wavelength of 850 nm.

Maximum power of 2.4 mW CW.

Caution: The use of optical instruments with this product will increase eye hazard. Do not view

powered encoder directly with optical instruments (microscopes, eye loupes, or magnifiers).

All maintenance procedures such as cleaning must be performed with the MicroE encoder

turned off.

Do not insert any reflective surface into the beam path when the encoder is powered.

Do not attempt to service the MicroE encoder.

Introduction

ChipEncoder Series

Installation Manual and Reference Guide

1.4 Standards Compliance

ChipEncoders are RoHS and REACH compliant.

1.5 Related Documentation

ChipEncoders Series Data Sheet

ChipEncoders Series Interface Drawings

1.6 Manual Revisions

Version Date Notes

Rev. 2 04/21/2022 Changed stencil thickness. New values for Sin+. REACH

compliance.

1.7 Trademarks

ChipEncoder is a registered trademark of MicroE Systems®.

1.8 Special Conventions Used

The following symbols may be used in this document.

Symbol Description

Warning or caution: potential damage to parts.

Instructions show correct method.

Instructions show example of incorrect method.

See Section 2.2 Single click with the mouse on these highlighted

references to jump to specified places in instructions.

Before Installation

ChipEncoder Series

Installation Manual and Reference Guide

2.0 Before Installation

Review the items in this section prior to installing the ChipEncoder.

2.1 Power Recommendations

The ChipEncoder requires a 5.0 VDC power supply:

The ChipEncoders require a minimum of 4.5 VDC continuously.

When designing circuits and extension cables to use ChipEncoders, be sure to account for

voltage loss over distance and tolerances from the nominal supply voltage so that at least

4.5 VDC is available to the ChipEncoder under all operating conditions. The supply voltage can

be confirmed by measuring between the applicable 5 V and ground pads.

The input voltage should not exceed 5.5 VDC.

2.2 Installation Considerations

The ChipEncoder is a precision electronic instrument. It has been designed to function in a wide range

of applications and environments. To take full advantage of the encoder design, allow easy access to

the sensor for service and/or replacement.

For optimal performance and reliability:

DO follow standard ESD precautions while handling the sensor.

DO allow proper clearance for sensor head alignment.

DO follow setup and alignment instructions for the encoder system.

DO, where possible, install the scales in an inverted or vertical position to minimize

accumulation of dust.

DO NOT store sensors in an uncontrolled environment.

DO NOT electrically overstress the sensor (power supply ripple/noise).

DO NOT intentionally “hot swap” the sensor if the device is energized.

2.3 Handling Considerations

Note: Follow Electrostatic Discharge (ESD) precautions at all times. Prior to reflow soldering, pay

particular attention to preventing ESD damage as the damage threshold is 500 V.

When handling the ChipEncoder, do not allow the pickup device to touch anywhere in the “Keep Out

Zone.”Refer to the following illustrations. Scratches or 'digs' in the Keep Out Zone can affect

ChipEncoder performance.

Keep Out Zone

CE300

Before Installation

ChipEncoder Series

Installation Manual and Reference Guide

2.4 Solder Paste Recommendation and Reflow Profile

The ChipEncoder can be soldered to a PCB using industry standard techniques. The diagram below

illustrates the recommended reflow temperature profile.

Lead-Free Solder Reflow

Use a temperature-controlled convection or IR reflow oven and SAC305 solder paste with no-clean flux

in either air or an inert atmosphere (N2). The temperature should be measured on the carrier board close

to the ChipEncoder parts and should not exceed 260°C.

The ChipEncoder has soldered devices under the cover. The rate of heating and cooling must be

controlled so that it does not exceed 5°C per second to avoid thermal stressing of the devices.

The ChipEncoder inputs and outputs are pre-tinned palladium silver pads with the typical spacing

between adjacent input/output pads of 0.2 mm (0.008 inches). The pads are pre-tinned with SAC305

solder alloy. Solder material with good slump characteristics should be chosen to ensure that solder

does not bridge or short during pre-heating in the reflow process.

Hand Soldering

Hand soldering can cause damage. Hand soldering guidelines:

CE300: Do not hand solder. Castellations are for electrical testing only.

CE: Hand solder only if necessary.

Reflow Solder

Temperature Profile

Before Installation

ChipEncoder Series

Installation Manual and Reference Guide

2.5 Application Notes

The printed circuit board (PCB) land pattern and assembly processes necessary to successfully

integrate the ChipEncoder are detailed as follows:

Use the publication IPC-7351 Generic Requirements for Surface Mount Design and Land

Pattern Standard (developed 2005 by IPC) as a guide for proper land pattern design for the

solder pads on the printed circuit board.

Due to the tight spacing between solder pads, it is recommended that solder mask be used

between the solder pads to prevent solder bridging and shorting to adjacent pads.

A 0.003 - 0.005inch thick stainless steel stencil is recommended for solder paste

application to the printed circuit board lands.

Machine placement and reflow soldering of the ChipEncoder is recommended.

Acetone is the recommended cleaner for the ChipEncoder.

PCB Requirements

The ChipEncoder electrical interface, land pattern, schematic of additional required passive components

and mechanical dimensions are found in the interface drawings, which are located on the following

webpage: http://www.microesystems.com/resource/product-documentation.

Before Installation

ChipEncoder Series

Installation Manual and Reference Guide

2.6 Installation Flowchart

The following flowchart lists the main steps in ChipEncoder installation.

Use Eval PCB

Design Interface

for Eval PCB

Perform Mechanical

Alignment

Perform PC Design

Section 4.3

Section 4.0

Confirm Alignment

(Optional)

Install

Complete

Install Encoder

Designing Own

PCB?

Yes

Install Scale

Section 5.0

System Overview

ChipEncoder Series

Installation Manual and Reference Guide

3.0 System Overview

This section identifies parts for the installation. Use the information in this section to design the

mounting scheme for the encoder.

3.1 ChipEncoder Models

Example of ChipEncoder Installed on a PCB

CE300-4, CE300-40 (7 mm x 11 mm) Top View

CE-40GC (6 mm x 6 mm) Top View

Ceramic

Substrate

Riser

Castellations (x24)

Beam Splitter

Date Code and

Serial Number

Beam Splitter

Ceramic

Substrate

Riser

ChipEncoder

System Overview

ChipEncoder Series

Installation Manual and Reference Guide

3.2 Linear and Rotary Glass Scales

The scales available for the ChipEncoder:

Linear Glass Scales

Rotary Glass Scales

Examples of scales (shown with ChipEncoder CE300)

3.3 Evaluation PCB

There are two alternatives for initially creating/designing a PCB to test with the ChipEncoder:

Design your own PCB and install the ChipEncoder to it

Purchase the Eval PCB and install the ChipEncoder to it (see Section 7.5 Evaluation Board

for more details). Once testing is successful, then a production PCB can be designed.

The ChipEncoder must be mechanically aligned to the scale. Alignment can be confirmed using an

Oscilloscope (see install procedure). See Section 8.0 Order Guide for details on ordering the Eval

PCB.

ChipEncoder Evaluation Board

U.S. Dime

Index

Linear Glass Scale

Rotary Glass Scale

Index

Evaluation PCB (CE300-4-PCB or CE300-40-PCB)

Evaluation PCB (CE-40GC-PCB)

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