ADLINK Technology SP-AL Manuel utilisateur

Leading EDGE COMPUTING

SP-AL

Open Frame Panel PC

User’s Manual

Manual Rev.: 1.0

Revision Date: June 22, 2018

Part No: 50-1Z258-1000

Leading EDGE COMPUTING

Revision History

Revision Release Date Description of Change(s)

1.0 June 22, 2018 Initial Release

Preface iii

SP-AL

Preface

This document contains proprietary information protected by copy-

right. All rights are reserved. No part of this manual may be repro-

duced by any mechanical, electronic, or other means in any form

without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior

notice in order to improve reliability, design, and function and does

not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, spe-

cial, incidental, or consequential damages arising out of the use or

inability to use the product or documentation, even if advised of

the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsi-

bility to global environmental preservation

through compliance with the European Union's

Restriction of Hazardous Substances (RoHS)

directive and Waste Electrical and Electronic

Equipment (WEEE) directive. Environmental

protection is a top priority for ADLINK. We have

enforced measures to ensure that our products,

manufacturing processes, components, and raw

materials have as little impact on the environment as possible.

When products are at their end of life, our customers are encour-

aged to dispose of them in accordance with the product disposal

and/or recovery programs prescribed by their nation or company.

iv Preface

Leading EDGE COMPUTING

Battery Labels (for products with battery)

California Proposition 65 Warning

WARNING: This product can expose you to chemicals

including acrylamide, arsenic, benzene, cadmium,

Tris(1,3-dichloro-2-propyl) phosphate (TDCPP), 1,4-

Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC,

and vinyl materials, which are known to the State of California to

cause cancer, and acrylamide, benzene, cadmium, lead, mercury,

phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and

vinyl materials, which are known to the State of California to cause

birth defects or other reproductive harm. For more information go

to www.P65Warnings.ca.gov.

Trademarks

Product names mentioned herein are used for identification pur-

poses only and may be trademarks and/or registered trademarks

of their respective companies.

Conventions

Take note of the following conventions used throughout this

manual to make sure that users perform certain tasks and

instructions properly.

NOTE:

Additional information, aids, and tips that help users perform

tasks.

ᑜ㔚ᳰ⺧࿁ᡴ

Preface v

SP-AL

CAUTION:

Information to prevent minor physical injury, component dam-

age, data loss, and/or program corruption when trying to com-

plete a task.

WARNING:

Information to prevent serious physical injury, component

damage, data loss, and/or program corruption when trying to

complete a specific task.

vi Preface

Leading EDGE COMPUTING

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Table of Contents vii

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Table of Contents

Preface.................................................................................... iii

List of Tables........................................................................ xiii

List of Figures....................................................................... xv

1 Introduction ....................................................................... 1

1.1 Features............................................................................... 1

1.2 General Specifications......................................................... 2

1.3 Display/Touch Specifications............................................... 4

1.4 Power Consumption ............................................................ 5

1.5 Thermal Specification .......................................................... 6

1.5.1 Heat Sink Specifications............................................. 6

1.5.2 Routing Considerations .............................................. 6

1.6 Mechanical Drawings........................................................... 7

1.6.1 10.1” Panel ................................................................. 7

1.6.2 12.1” Panel ................................................................. 9

1.6.3 15.6” Panel ............................................................... 11

1.6.4 18.5” Panel ............................................................... 13

1.6.5 21.5” Panel ............................................................... 15

1.7 External I/O Connectors .................................................... 17

1.7.1 DB-9P COM Port Connector .................................... 17

1.7.2 USB Ports................................................................. 19

1.7.3 DisplayPort Connector.............................................. 19

1.7.4 Dual Gigabit Ethernet Ports...................................... 21

1.8 Internal I/O Connectors...................................................... 22

1.8.1 Power Connector...................................................... 24

1.8.2 SMBUS Connector ................................................... 24

1.8.3 Mini PCIe Port .......................................................... 25

1.8.4 CMOS Jumper.......................................................... 25

1.8.5 USB 2.0 Port............................................................. 26

viii Table of Contents

Leading EDGE COMPUTING

1.8.6 I2C Connector........................................................... 27

1.8.7 Data Input Keys ........................................................ 28

1.8.8 Power & Reset Connector ........................................ 29

1.8.9 2W Speaker Connectors........................................... 30

1.8.10 MIC in\Line out Connectors ...................................... 31

1.8.11 M.2 SSD slot............................................................. 31

1.8.12 LED Connector ......................................................... 32

1.8.13 I2C Connector........................................................... 33

1.8.14 Control Keys Connector............................................ 34

1.8.15 Debug Connector...................................................... 35

1.8.16 GPI/O Connector ...................................................... 37

1.8.17 SIM Card Slot ........................................................... 39

1.9 SEMA................................................................................. 39

2 Getting Started.................................................................. 41

2.1 Unpacking Checklist .......................................................... 41

2.2 External I/O Options........................................................... 41

2.3 Installing/Changing 2.5” SATA SSD/HDD.......................... 43

2.4 Installing/Changing SO-DIMM ........................................... 44

2.4.1 E3930 CPU-equipped Models .................................. 44

2.4.2 E3950 CPU-equipped Models .................................. 44

2.5 Installing/Changing a Mini PCIe Wireless Card ................. 46

2.5.1 E3930 CPU-equipped Models .................................. 46

2.5.2 E3950 CPU-equipped Models .................................. 47

2.6 Connecting DC Power ....................................................... 48

3 Driver & Application Installation ..................................... 49

3.1 Installing the Chipset Driver ............................................... 49

3.2 Installing the Graphics Driver............................................. 50

3.3 Installing the Ethernet Driver.............................................. 50

3.4 Installing the USB 3.0 Driver.............................................. 51

3.5 Installing the I/O Driver ...................................................... 51

Table of Contents ix

SP-AL

3.6 Installing the SEMA Utility, WDT and DI/O Drivers............ 51

A Appendix: BIOS Setup......................................................53

A.1 Main ................................................................................... 54

BIOS Information .......................................................... 54

System Information ....................................................... 54

System Time/System Date ........................................... 55

Access Level ................................................................. 55

A.1.1 Board Information ..................................................... 56

Runtime Statistics ......................................................... 56

A.2 Advanced........................................................................... 57

A.2.1 CPU Configuration.................................................... 58

EIST .............................................................................. 58

Turbo Mode .................................................................. 58

Intel Virtualization Technology ...................................... 58

C-States ........................................................................ 58

DTS .............................................................................. 59

A.2.2 Graphics Configuration............................................. 60

Data Formation and Color Depth .................................. 60

LVDS Output Mode ....................................................... 60

DE Polarity .................................................................... 60

Vsync Polarity ............................................................... 60

Hsync Polarity ............................................................... 61

Active LFP Config ......................................................... 61

LEP Panel Type ............................................................ 61

A.2.3 Power Management ................................................. 63

Enable ACPI Auto Configuration .................................. 63

Enable Hibernation ....................................................... 63

ACPI Sleep State .......................................................... 63

Lock Legacy Resources ............................................... 63

mPCIe Slot Wake ......................................................... 64

LAN Wake ..................................................................... 64

xTableofContents

Leading EDGE COMPUTING

RTC Wake system from S5 .......................................... 64

Emulation AT/ATX ........................................................ 64

LAN#1 Control .............................................................. 64

LAN#2 Control .............................................................. 64

Power Consumption ..................................................... 64

A.2.4 System Management................................................ 66

SEMA Features ............................................................ 66

Flags ............................................................................. 66

A.2.5 Thermal Management............................................... 67

Critical Trip Point .......................................................... 67

Passive Cooling Trip Point ............................................ 67

A.2.6 Watchdog Timer ....................................................... 68

Power-Up Watchdog ..................................................... 68

RunTime Watchdog ...................................................... 68

A.2.7 Super IO Configuration ............................................. 69

A.2.8 Serial Console Redirection ....................................... 70

A.2.9 Network Stack Configuration .................................... 71

A.2.10 Trusted Computing ................................................... 72

A.2.11 USB Configuration .................................................... 73

XHCI Hand-off .............................................................. 73

USB Mass Storage Driver Support ............................... 73

USB transfer time-out ................................................... 73

Device reset time-out .................................................... 73

Device power-up delay ................................................. 74

A.2.12 Intel I211 Gigabit Network Connection ..................... 74

NIC Configuration ......................................................... 75

Link Speed .................................................................... 75

Wake On Lan ................................................................ 75

A.3 Chipset............................................................................... 76

A.3.1 North Bridge.............................................................. 77

A.3.2 South Bridge ............................................................. 78

A.3.3 Uncore Configuration................................................ 79

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